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High-Throughput Precise Dotting in Electronics Assembly
Keywords: electro-mechanical module assembly, dispense, precise dotting
In Electro-Mechanical Module Assembly (EMMA), adhesive and encapsulation materials are applied to protect electronic components from physical stress, contamination, and electrical bridging. Assembly processes have evolved dramatically in recent years due to cost saving efforts, increasingly smaller form factors, and mass customization. These changes have resulted in advanced and dynamic standards for equipment manufacturers in terms of speed, precision, and flexibility. For automated fluid dispensing, challenges include maintaining high-throughput to keep pace with upstream pick-and-place processes, enabling precise fluid delivery into narrow gaps between components, and avoiding keep out zones (KOZs). Nordson ASYMTEK has developed a high-throughput, precise fluid dispensing process to match the production rate of 15,000 to 50,000 chips per hour (CPH), a typical speed for pick-and-place systems. The process meets EMMA requirements by delivering a narrow fluid stream with a placement accuracy range of 0.025 – 0.065mm and an adhesive wet-out zone of 0.2 – 1.0mm. The process includes a new jetting technique, new dispensing system, and the use of unique software features. The paper will discuss the following application examples: optical lens encapsulation, camera module image sensor attach, and the placement of a non-conductive adhesive boundary around a hard disk drive piezo actuator.
Hanzhuang Liang,
Nordson Asymtek
Carlsbad, ca
USA


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