Here is the abstract you requested from the dpc_2019 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|High-Throughput Precise Dotting in Electronics Assembly|
|Keywords: electro-mechanical module assembly, dispense, precise dotting|
|In Electro-Mechanical Module Assembly (EMMA), adhesive and encapsulation materials are applied to protect electronic components from physical stress, contamination, and electrical bridging. Assembly processes have evolved dramatically in recent years due to cost saving efforts, increasingly smaller form factors, and mass customization. These changes have resulted in advanced and dynamic standards for equipment manufacturers in terms of speed, precision, and flexibility. For automated fluid dispensing, challenges include maintaining high-throughput to keep pace with upstream pick-and-place processes, enabling precise fluid delivery into narrow gaps between components, and avoiding keep out zones (KOZs). Nordson ASYMTEK has developed a high-throughput, precise fluid dispensing process to match the production rate of 15,000 to 50,000 chips per hour (CPH), a typical speed for pick-and-place systems. The process meets EMMA requirements by delivering a narrow fluid stream with a placement accuracy range of 0.025 – 0.065mm and an adhesive wet-out zone of 0.2 – 1.0mm. The process includes a new jetting technique, new dispensing system, and the use of unique software features. The paper will discuss the following application examples: optical lens encapsulation, camera module image sensor attach, and the placement of a non-conductive adhesive boundary around a hard disk drive piezo actuator.|