Abstract Preview

Here is the abstract you requested from the dpc_2019 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Organic Substrate Technologies for Fingerprint Sensors
Keywords: fingerprint, photo, substrate
Fingerprint sensor had a long history. With the mobile electronics security application being ushered in several years back, miniature and low-cost capacitive fingerprint sensors enjoyed an explosion growth. One technology to make such a low-cost, highly sensitive, high environment tolerating and reliable technology is to use organic substrate to construct sensing element. In this paper, several technologies are reviewed. They include Si based absolute capacitive sensors, film-based transcapacitive technology, organic substrate-based transcapacitive technology. To make highly sensitive substrate sensor, a newly invented architecture has been achieved with new photosensitive material in combination with traditional substrate manufacturing process, resulting the best performance at very low cost. Detailed manufacturing process and performance evaluation results will be presented.
Shengmin Wen,
Synaptics Inc
Phoenix, AZ

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic