Abstract Preview

Here is the abstract you requested from the dpc_2019 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Packing trends and challenges for the next generation automotive
Keywords: Automotive Packaging, Advanced Packaging, Autonomous driving
Nowadays, the automotive industry is using more and more semiconductor content which will keep increasing in the coming years. The quantity of electronics in a car has increased 2.5 times since the 90s and will continue its growth. In 2017, 26 cm of semiconductor substrates was used in a car, which is expected to increase to 35cm2 in 2023. Electronics in vehicles become more and more complex, packaging becomes more and more significant. The working environment of electronics became harsher, the packaging technologies must adapt to reliability requirements: new failure modes, new testing methods and qualification regulation is needed which need solutions developed by the whole supply chain, from materials to package design and testing. There is the trend of more and more outsourcing from the IDMs to OSATs and depending on the application, the same player may have different business model, resulting in very complex supply chain. There are significant demands for power applications that can drive innovation. A second wave could be led by increasing autonomy and connectivity. It is important also to notice that is the first time in history that a big effort is made to adapt consumer technologies to automotive to drive innovation in dedicated applications such as powertrain. Although the main platform in term of units is the Wire Bond Ball Grid Array (WBBGA) package, which represents half of the market, advanced packaging platforms such as flip-chip and fan-out are finding their place. The next innovation expected is embedded die in substrate for converter dies. The advanced packaging for automotive is involved in many device types and thus in many packaging platforms. This presentation will focus on the latest technology and market trends of the automotive packaging, covering various applications such as radar, LiDAR, power devices, lighting and photonics.
Santosh Kumar,
Yole Developpement
Seoul, Seoul
South Korea

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic