Here is the abstract you requested from the dpc_2019 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|3D IC: Overview of Industry Status|
|Keywords: 3D IC, si interposer, 2.5d|
|This presentation will provide a comprehensive landscape of the current status of 3D IC including the main trends of utilizing TSV based stacked 3DIC as well as Si interposer based 2.5D IC packages. The differentiation of the market requirements (and cost) that drives technology development and commercialization will be explained and summarized. TSV less 3DIC development options will be discussed. In addition, brief overview of the challenges of 'transistor level stacking' will be provided.|
San Diego, CA