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Thinking in 3D - The New Architecture
Keywords: DBI, Direct Bond Interconnect, Hybrid Bonding
Advancements in image sensors, RF devices and memory have highlighted a better approach to performance improvements than trotting along a Moore’s Law path. 3D approaches have benefits that can far surpass shrinking nodes. This presentation discusses the benefits and barriers in designing true 3D SoC devices
Javi DeLaCruz, VP of Engineering
XPERI Corporation
, CA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic