Here is the abstract you requested from the dpc_2019 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Thinking in 3D - The New Architecture|
|Keywords: DBI, Direct Bond Interconnect, Hybrid Bonding|
|Advancements in image sensors, RF devices and memory have highlighted a better approach to performance improvements than trotting along a Moore’s Law path. 3D approaches have benefits that can far surpass shrinking nodes. This presentation discusses the benefits and barriers in designing true 3D SoC devices|
|Javi DeLaCruz, VP of Engineering