Here is the abstract you requested from the hiten_2019 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Simulating the Effect of Elastic Particle Inclusion on the Mechanical Properties of Transient Liquid Phase Sintered (TLPS) Alloys|
|Keywords: Packaging, Solders, Reliability|
|The need for power electronic devices and materials that can operate in harsh environments, together with the Restriction of Hazardous Substances (RoHS) legislation, has pushed the industry and researchers to develop new attach materials. Transient Liquid Phase Sintered (TLPS) joints are strong candidates to replace the current die attach materials due to their superior mechanical, thermal, and electrical properties. Despite these qualities, current TLPS systems may exhibit stiff and brittle behavior that can lead to die or attach fracture under thermomechanical stress during wide temperature range cycling or under mechanical stress from shock and vibration loading, such as is experienced in automotive electronics. A new approach of adding an additional compliant particles into the system is evaluated through finite element analysis. Modeling and simulation were used to assess the potential of various candidate particles to reduce the stiffness and brittleness of the joint. A model of the TLPS system is generated by including different spheres for various particles in the joint. This is done through mathematical programming using MATLAB code to determine the locations of the spheres. SolidWorks is then used to convert the mathematical code into a CAD model. Once the model is ready, several uniaxial tension and compression simulations are performed in ANSYS. Mesh independency studies are performed due to the highly randomized geometries of the models to ensure accurate results. This work characterizes the elastic behavior and mechanical properties of Cu-Sn alloy system with the inclusion of different volume percentage of compliant particles. Results show a decrease in elastic modulus with an increase of volume percentage of compliant particles.|
|Patrick McCluskey, Professor
University of Maryland, College Park
College Park, MD