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A novel class of multiscale nanomaterials based thermal interface materials for high temperature, high power density electronics
Keywords: High temperature electronics, thermal interface material, Ag pastes
Thermal issues are a major factor of performance limitation in wide bandgap electronic applications, especially when their operations are pushing toward higher power densities and higher use temperatures and oftentimes thermal stress induced mechanic failure become inevitable. These issues calls for the use of new- generation thermal interface materials (TIM) for die attachment and the associated electronics packaging, which are crucially important to enable a safe, stable and reliable operations at high-temperatures and high power densities. This paper presents a new class of nanomaterial– based thermal interface materials (TIM), a novel hybrid Ag-based TIM paste, namely high temperature solder. This reported TIM paste is featured with the incorporation of multiscale of Ag nanoparticles and Ag-nanocoated carbon nanotubes, which will enable a low-temperature, pressure-less bonding process. This hybrid Ag-based TIM is expected to possess enhanced thermal and mechanical performance in the resultant joints when compared to those of currently available TIM products, including increased temperature range (-30 to 300˚C), and enhanced mechanical strength (>30 MPa) and thermal conductivity (>70W/m·K). In addition, this TIM pastes can be directly applied to the current power electric packaging production lines, and especially this paste can be bonded with bare Cu surfaces without the application of external pressures and inert protective gases, using a simplified, low-temperature process.
Timothy Lin, Technical Director
Aegis Technology
Santa Ana, CA
USA


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