Here is the abstract you requested from the imaps_2019 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Surface Sensitive Process Controls for Improving Wire Bonded Joint Reliability in Microelectronics Manufacturing|
|Keywords: improving wire bonded joint reliability, non-destructive inspection device, validation of plasma activation|
|Validating surface chemical composition and properties of die pad surfaces is crucial for achieving joint reliability in microelectronic wire bonding operations. Die pad surfaces undergo a number of surface sensitive manufacturing steps prior to bonding that will affect joint performance; contact and environmental contaminants from process aids, shipping, handling, storage and out time are all key players in surface degradation. Typically, microelectronics manufacturers implement cleaning and/or surface activation operations to remediate surfaces from upstream contaminants, however, understanding and quantifying the effect of such processes requires the ability to manipulate and monitor the top few molecular layers of a surface responsible for adhesion. This presentation will investigate surface chemistries of atmospheric plasma cleaned and non-cleaned die pad surfaces as determined by X-ray photoelectron spectroscopy (XPS) and surface energy measurements via contact angle techniques. Surface chemistries and energies of these materials will then be compared to overall joint performance.|
|Elizabeth Kidd, R&D Chemist, Custom Applications Scientist