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Surface Sensitive Process Controls for Improving Wire Bonded Joint Reliability in Microelectronics Manufacturing
Keywords: improving wire bonded joint reliability, non-destructive inspection device, validation of plasma activation
Validating surface chemical composition and properties of die pad surfaces is crucial for achieving joint reliability in microelectronic wire bonding operations. Die pad surfaces undergo a number of surface sensitive manufacturing steps prior to bonding that will affect joint performance; contact and environmental contaminants from process aids, shipping, handling, storage and out time are all key players in surface degradation. Typically, microelectronics manufacturers implement cleaning and/or surface activation operations to remediate surfaces from upstream contaminants, however, understanding and quantifying the effect of such processes requires the ability to manipulate and monitor the top few molecular layers of a surface responsible for adhesion. This presentation will investigate surface chemistries of atmospheric plasma cleaned and non-cleaned die pad surfaces as determined by X-ray photoelectron spectroscopy (XPS) and surface energy measurements via contact angle techniques. Surface chemistries and energies of these materials will then be compared to overall joint performance.
Elizabeth Kidd, R&D Chemist, Custom Applications Scientist
BTG Labs
Cincinnati, OH
United States

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic