Here is the abstract you requested from the imaps_2019 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Control of Solder Bump Growing Morphology in Lead Free Plating|
|Keywords: Solder bump, Ag composition, LF Bump|
|Plating Solder bump is one of the key technologies for flip chip assembly methodology. Flip chip assembly had been moved forward to higher integration and downsizing with new technologies. The electroplating is a very promising technology for finer bump formation compare with solder printing and ball mounting. Hence, the plating solder bump growing morphology is quite important for process quality control and design rule constructed. This paper aims to study the plated solder behavior from as-plating mushroom to after reflowed bump formation under different photoresist opening. In addition, take following process into overall consideration and finalize the design rule for electroplating solder bump.|
|Berdy Weng, Department Manager