Here is the abstract you requested from the imaps_2019 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|High Temperature and High Reliability Performance of Electrically Conductive Film Adhesives for RF Grounding Applications|
|Keywords: Adhesive, Film, High Temperature|
|Over the past decade, electronic parts have become smaller, more complex and higher-functioning. This is well-understood for many products within the consumer and handheld markets. Miniaturization, however, is also impacting sectors such as aerospace and automotive, pushing the limits of already harsh environments. As more power is driven through active devices, the integrity of materials used to provide the electrically conductive interfaces is becoming increasingly critical. For many applications, adhesive films have been the preferred material because they offer a variety of performance and operational advantages such high electrical and thermal conductivity, uniform bondlines, superior adhesion and low processing temperatures. Today, though, as miniaturization pushes power-density limits and devices are also being exposed to high operating temperatures, even traditionally robust adhesive films are challenged to cope with these conditions. In sectors such as aerospace where high reliability is essential, material capability must evolve to deliver on fail-safe performance expectations. This paper will compare the performance of an established and widely-used electrically conductive film adhesive with that of a newly-developed film designed to provide improved mechanical performance over a higher elevated temperature range.|
|Douglas Katze, Market Manager - Defense & Aerospace
Rocky Hill, CT