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Solder Joint Interconnections in Automotive Electronics: Design-for-Reliability and Accelerated Testing
Keywords: automotive electronics, design for reability, predictive modeling
This presentation is based on the author’s recent work on design-for-reliability and accelerated testing of solder joint interconnections (SJIs) employed in electronic packaging. The emphasis is on automotive applications. The following three critical and challenging problems are addressed and the appropriate solutions are suggested and discussed: 1) Could inelastic strains in the solder material, particularly the one of the second level of interconnections, be avoided by a rational design, and, if not, could the sizes of the inelastic strain areas be predicted and minimized [1-17]? 2)Considering that the difference between an highly reliable and an insufficiently reliable electronic product is “merely” in the level of its never-zero probability of failure, and that the SJI is typically the most vulnerable structural element in an IC package design, could this probability be assessed at the design stage and, if necessary, minimized[18-26]? 3) Should temperature cycling accelerated testing for SJIs be replaced by a more physically meaningful, less costly, less time- and labor- consuming approach, especially having in mind automotive applications [27-36]? The suggested solutions to these problems are obtained by using analytical predictive modeling, and low-temperature/random-vibrations bias is suggested (and even “reduced to practice”) as an attractive and promising replacement of temperature cycling. The general concepts are illustrated by detailed numerical examples.
Ephraim Suhir,
Portland State University, Portland, OR, USA
Los Altos, CA
USA


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