Here is the abstract you requested from the imaps_2019 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Optimized ECD Cu RDL Process with Via Filling Capability for Next Generation Packaging|
|Keywords: ECD Cu, via filling, RDL|
|Next generation mobile devices, especially those with 5G capability, will require higher functionality and speed in combination with shrinking component as well as package dimensions. These requirements pose challenges to upcoming heterogeneous integration. In order to account for the increasingly complex technologies, filling of vias with copper will be required for packaging of the various components. Examples for such via filling applications include next generation radio frequency (RF) filters and multilayer redistribution layers (RDLs). However, the size scales of these applications vary from 100 µm to sub 5 µm. In addition to via filling of different dimensions and aspect ratios, the copper electrodeposition process is also supposed to be able to plate lines and pads within the RDLs. Chemistry solutions will be discussed with respect to their suitability to deposit copper into this broad variety of structures and, at the same time, to fulfill the requirements of a package with 5G capability.|