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First Demonstration of Ultra-Thin Glass Panel Embedded Package with Epoxy Molding Compound for 5G/mm-wave Applications
Keywords: Glass Panel Embedding, 3D SiP, Epoxy Molding Compound
With the number of connected-devices increasing radically, communication data rates are projected to be at least 10-100X in the 5G/mm-wave technology - much higher than existing 4G LTE connections.[1], [2] To catch up with the trend, novel packaging technology in the mm-wave frequency range is required, which addresses fundamental mm-wave technical challenges such as high dielectric loss, degradation of quality factors in passives, increased parasitics, dramatically-enhanced electromagnetic interference, and the reduced radiation efficiency of antenna arrays. State-of-the-art approaches use organic-core substrates that have a low dielectric constant (Dk) and low dissipation factor (Df) such as fluorosis-based and liquid-crystal polymer (LCP) substrates in order to achieve high antenna performance and low signal dissipations. Theses organic-based substrate technologies, however, can neither miniaturize packages nor handle highly-precise signal routings that enable high density packages. To address these challenges, Fan -Out Wafer Level Package (FO-WLP) technologies, like eWLB, InFO, and SWIFT are gaining attention, where integrated circuits (ICs) are embedded in epoxy molding compound. [3], [4], [5], [6] Recently, glass-panel embedding (GPE) technology is emerging as an ideal packaging methodology that enables superior performance along with small form factor, ultra-low-loss high density, ultra-short interconnects, and low cost. [7] These benefits are as a result of the advantages of glass such as its smooth surface for precision RDL, excellent dimensional stability for panel-scalability and tailorability of CTE that allow direct board-attach for improved system performance. In addition, epoxy molding compound as encapsulation allows the GPE package to be thinner and more robust package. Molding Glass Cavity panels also enhances the handing of ultra-thin glass which is seen as a bottleneck towards glass in package production. This also enhances throughput by allowing more cavity cut outs (more coupons) per panel. This paper therefore presents the first demonstration of ultra-thin GPE with sheet-type epoxy molding compound (SMC) for 5G/millimeter-wave applications. First part of this paper discusses the processes of the glass-panel embedding laminated with SMC, including chip placement in glass cavities, lamination of SMC, and the reliability of the packaging architecture. This demonstration was performed in 100-μm glass substrates and 40-μm SMC. The second part of this paper focuses on low-loss interconnects for 5G/mm-wave applications and presents the process development of signal routings such as transmission lines and microvias in re-distribution layers (RDLs) and through-package vias (TPVs) with via-in-via process. The results suggest that the ultra-thin GPE architecture is a promising packaging technology for various type of applications such as high-frequency communications and high-performance computing.
Nobuo Ogura,
NAGASE & CO., Ltd, Georgia Institute of Technology
Chuo-ku, Tokyo
Japan


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