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New Low Temperature Cure Hybrid BCB Platform as a Low Loss Photoimeagable Dielectric for 5G HS/HF Applications
Keywords: Dielectric, Dissipation Factor, Photoimeageable
Fifth generation network technology, often referred to as 5G, holds great potential for higher communication speeds, higher data transmission rates and improved connectivity, however current dielectric materials lack sufficiently low dielectric loss (Df) at desired form factors for next generation devices. While photoimeageable dielectrics will certainly play a role in 5G manufacturing, many of the chemistries that have evolved and are suitable for photodielectrics (aqueous developed and polar solvent developed materials) have too high a Df for a 5G devices. Benzocyclobutene (BCB) has long been known for its low dielectric properties and found use a number of high frequency applications especially GaAs devices. A newly designed, hybrid BCB platform has been developed that utilizes new monomer and polymer chemistry to deliver a system capable of low temperature cure within 1 hour at 170-200°C, self-priming adhesion (on silicon, copper, silicon nitride and polyimide), improved mechanical properties (20-30% tensile elongation) and low Df at high frequency in full formulation (<0.005 24-40GHz). Chemical resistance of both the soft and the hard cured Hybrid BCB platform as well as good adhesion between layers in a multilayer build are demonstrated. Hybrid BCB as a spin on Photodielectric material is also capable of achieving a variety of final film thicknesses from 15-25 µm and can achieve high aspect ratio imaging with 1:1 AR vias using a I-line Karl Süss Mask Aligner and 2:1 AR on a 0.48NA ASML i-line stepper). Moreover this photodielectric material can be developed using desirable solvents such as esters like propylene glycol monomethyl ether acetate. The new Hybrid BCB spin on Photodielectric material demonstrates considerable promise for manufacturing next generation 5G devices.
Colin Hayes, Associate Scientist
DuPont
Marlborough, MA
USA


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