Abstract Preview

Here is the abstract you requested from the imaps_2019 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Low temperature curable low Df photosensitive polyimide
Keywords: polyimide, Low Df, photosensitive
We succefully developed low temperature curable Low Df polyimide which is sutable for RF applications. Polyimide was designed to show low loss tangent as well as low dielectric constant. In addition to achive low temperature curable nature, the low Df polyimide is preimidized. The photosensitive polyimide has negative photosensitivity. The photosensitive polyimide shows not only low Df but the polyimide shows good Cu compatibility and adhesive nature. The developed photosensitive polyimide will be suitable for distribution of RF semiconductor and components.
Masao Tomikawa,
Toray Industries Inc
Otsu, Shiga

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic