KemLab

Abstract Preview

Here is the abstract you requested from the imaps_2019 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Development of High Thermally Conductive Die Attach for TIM applications
Keywords: High Thermals, Sintered Silver, Thermal Interface Material
High power semiconductor applications require a Thermal Interface Die Attach Material with high thermal conductivity to efficiently release the heat generated from these devices. Current Thermal Interface Material solutions such as thermal grease, thermal pads and silicones have been industry standards, however may fall short in performance for high temperature or high stress applications. This presentation will focus on development of a cutting-edge Die Attach Solution for Thermal Interface Management. That includes; epoxy-based Ag adhesive with a extremally low Storage Modulus and the Thermal Conductivity reaching 6W/mK, and also Very Low Modulus Sintered Silver with the Thermal Conductivity of 70W/mK.
Maciej Patelka, Area Manager
NAMICS
San Jose, CA
United States


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic