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Here is the abstract you requested from the imaps_2019 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

System I/O Optimization with Chip, Package, PCB Co-Design.
Keywords: package-on-package design, PCB design, 3D design
The increasing complexity of system on chips (SoCs) combined with a new generation of designs that combine multiple chips in a single package is creating new challenges in the design of packages, printed circuit boards (PCBs) and integrated circuits (ICs). The process typically involves three independent design processes � chip, package and PCB � carried out with point tools whose interface requires time-consuming manual processes that are error-prone and limit the potential for reuse. This challenge is being addressed by a new integrated 3D chip/package/board co-design environment that makes it possible to holistically optimize the package, board and IC design to a greater degree than was possible in the past by considering the system-level impact of each design decision. The new co- design approach enables designers to optimize routability via pin assignment and I/O placement to achieve minimum layer counts between chip, package and board. The end result is higher performance.
Humair Mandavia, CSO
Zuken, Inc
San Jose, California
United States


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