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Novel Material & Processing Equipment Integration to Provide Smart, Reliable & Low-Cost Solution to Today's Packaging Challenges
Keywords: novel material, ink-jet, processing equipment integration
Successful construction of advanced and reliable packaging architecture is currently being challenged by proper selection of available materials, interactions among these materials used during reliability tests and the equipment set to do the assembly. Lastly, once the package construction conditions are satisfied, the acceptability of the final product depends on its total cost of ownership. While several incremental solutions are constantly being developed to address these materials related challenges, new versions of processing and handling equipment are also required to enable final assembly, all of which impact final cost of ownership. To overcome these incremental solutions, it is necessary to establish a simple, practical, and novel solution for the semiconductor packaging and assembly industry. This paper highlights such an approach, in which development of compatible new material sets and integration with ink-jet deposition technology have been successful. Examples of few such applications in back-end packaging, along with the uniquely observed advantages, are shared in this paper. The driving force for integrating ink-jet technology in semiconductor packaging and assembly is its high material utilization with minimal wastage. Once the application specific material properties are optimized for ink-jetting, total cost of ownership drops - especially while replacing conventional spin-on liquid processes. Further, there are some high reliability applications that requires fine 3-dimensional protection using ink-jet to cover selective areas of WLP packages, which may not be possible otherwise. Working closely with leading ink-jet equipment makers, these 'deposition methods + material sets' have been optimized. This has resulted in providing unique packaging solutions. Ink-jet deposition method is already an established technology proven in display and solar cell industries for more than two decades - where high resolution and large area coatings are successfully performed in high volume manufacturing. However, its effective use towards semiconductor packaging solutions can only be achieved through optimizing formulation and rheology of applicable materials. Current generation equipment is commercially available to handle large size panels (e.g. 1950 x 2250 mm glass) for display and wafer handling systems for solar cells. Basic equipment and process infrastructure are in place. Having pioneered the new materials for display industry and now developing new materials for semiconductor packaging - this combined experience has been capitalized to formulate different material sets with optimum properties for ink-jet applications. Some of these replace spin-on dielectric and photoresist - resulting in more than 80% reduction in material wastage. These process details and performance results are presented where material rheology for critical features and parameters optimization is necessary. Another critical application is the selective deposition technique for edge protection of WLPs for high reliability - especially critical for automotive applications. The process details and performance data are presented. Interaction of various parameters have been discussed. The results are encouraging. Although the incentives to use ink-jet have been demonstrated, nevertheless there is likely to be some hurdles for this technology to be accepted in the main stream of back-end semiconductor assembly. Industry infrastructure to support such materials and equipment would be of likely concerns. Keeping this in mind, major efforts are currently in progress for the materials and equipment suppliers working together to optimize the application parameters and provide a joint technology package to a IDMs' and OSATs' assembly lines. Objective is to offer a simple 'plug-in solution'.
Pawel Miskiewicz,
Merck KGaA
Darmstadt, D

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