Here is the abstract you requested from the imaps_2019 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Robust RoHS-Compliant Solder Materials for High Reliability, High Performance Applications|
|Keywords: Solder Materials, High Reliability, High Performance|
|Challenging and harsh conditions such as those found in the automotive sector demand high reliability material solutions. For quite some time, high-integrity interconnects for these applications have been achieved through the continued use of conventional tin-lead solder materials – a practice which has only been allowed more recently through exemptions from RoHS legislation. As these exemptions are phased out, however, the electronics industry must respond with suitable RoHS-compliant solder materials that do not compromise reliability. Widely used conventional SAC alloys, while suitable for a variety of consumer and industrial applications, do not meet the stringent reliability standards of many products that operate within environments where harsh conditions are the norm. In this work, the authors will present a comparison of traditional SAC alloys versus a new, high reliability, lead-free alloy designed in collaboration with and for the automotive industry to meet strict reliability criteria for lead-free interconnects.|