Honeywell

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Film Based Moisture Absorbers for Implantable Devices
Keywords: Implantable Devices, Next Gen Technology, Mositure Absorbers
Traditional hermetic packages used in medical implantable and other applications often require high reliability and have an upper limit of < 1,000 ppm of water vapor content at the time of fabrication. Package leak rate is limited to 10-8 atm-cc/sec maximum to prevent entry of significant moisture during the device’s expected lifetime. However, it is difficult to manufacture a hermetic microelectronic package for implantable devices with low water vapor content and to maintain low moisture levels during its anticipated lifetime of approximately ten years. There are mechanisms for water vapor to enter the package interior that include seal leakage, water generated during the sealing process and moisture outgassing from adhesives or even the internal package and components over its lifetime. The best long-term reliability assurance requires the use of moisture getters employed inside the implantable device. Moisture getters contain potent desiccants dispersed within a permeable matrix that is typically a polymer. Desiccants can be inorganic compounds that form hydrates by combining with one or more molecules of water and permanently eliminating moisture from the package atmosphere. As implantable devices continue to implement next generation semiconductor technology and increased functionality is placed into these implantable devices, moisture protection will continue to be a concern of implantable device manufactures. This presentation will discuss developments and progress of new film based moisture getters for next generation implantable devices.
Michael Previti, Global Product Manager
Alpha Advanced Materials
Suwanee, GA
USA


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