Honeywell

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Technologies for wafer-level glass-based packaging and bonding
Keywords: Wafer level glass based packaging, Low temperature bonding, Electrical interfacing
When looking at microsystems used in healthcare applications, and at (bio)MEMS devices in particular, a large contributor to the total cost of R&D, but ultimately also of the finished device, is the packaging. But aside from cost, in these kind of packaging cases, specific technical challenges have to be overcome, for instance safety issues (e.g. protecting the patient from the device), reliability issues (e.g. protecting the device from the patient), and purely technical issues (e.g. restrictions regarding packaging processes, based on the device-to-be-packaged). It is therefore that there is an increased demand for advanced packaging technologies for MEMS components. In this presentation we will discuss a number of (low temperature) bonding technologies, focused on using glass as a material for wafer level packaging of devices and on keeping the thermal load during the packaging process low. Two of the candidates are laser assisted bonding and wafer level packaging using a dry film resist material. Aside from discussing these wafer level packaging processes, example cases will be given to demonstrate applicability and pros/cons of the selected technologies will be discussed. In addition, an update regarding our metallized through glass via technology will be presented, which, in combination with processes specifically developed for multi-layer electrical redistribution structures, allows further device miniaturization and integration.
Marko Blom, CTO
Micronit Microtechnologies
Enschede, OV
The Netherlands


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