Here is the abstract you requested from the medical_2019 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|3D Interconnect Technologies and Integration for Multi-Electrode Arrays for In Vivo and In Vitro Medical Applications|
|Keywords: 3D interconnect, multi-electrode arrays, in vitro medical|
|This work presents fabrication and characterization of flexible three-dimensional (3D) multi-electrode arrays (MEAs) capable of high signal-to-noise (SNR) electromyogram (EMG) recordings from the expiratory muscle of a songbird. The fabrication utilizes innovative processes to obtain 3D structures to serve as the electrodes. A polyimide base with a PDMS top insulation was utilized to ensure flexibility and biocompatibility of the fabricated 3D MEA devices. SNR measurements from the fabricated 3D electrode show up to a 7x improvement as compared to the 2D MEAs. In this presentation, we also discuss application of advanced 3D interconnects and micro-integration for a 3D platform featuring 'disposable' electronic microplate interfaced to CMOS biosensors for cell-based assay.|
Georgia Institute of Technology