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3D Interconnect Technologies and Integration for Multi-Electrode Arrays for In Vivo and In Vitro Medical Applications
Keywords: 3D interconnect, multi-electrode arrays, in vitro medical
This work presents fabrication and characterization of flexible three-dimensional (3D) multi-electrode arrays (MEAs) capable of high signal-to-noise (SNR) electromyogram (EMG) recordings from the expiratory muscle of a songbird. The fabrication utilizes innovative processes to obtain 3D structures to serve as the electrodes. A polyimide base with a PDMS top insulation was utilized to ensure flexibility and biocompatibility of the fabricated 3D MEA devices. SNR measurements from the fabricated 3D electrode show up to a 7x improvement as compared to the 2D MEAs. In this presentation, we also discuss application of advanced 3D interconnects and micro-integration for a 3D platform featuring 'disposable' electronic microplate interfaced to CMOS biosensors for cell-based assay.
Muhannad Bakir,
Georgia Institute of Technology
Atlanta, GA
USA


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