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High-throughput via formation in solid-core glass for IC substrates
Keywords: Through-Glass Via (TGV), Advanced IC Packaging, Glass-Core Technology
IC substrates are facing increased requirements regarding warpage, thermal expansion, total thickness variation and RF performance. Solid glass has typically superior electrical and thermal properties over organic glass-filled substrates, which makes it a promising alternative platform technology for advanced IC substrates. However, the economical formation of vias in solid glass core substrates has traditionally been a challenge, since conventional techniques are often prone to induce micro cracks, thermal stress or chipping. In addition, such techniques are often associated with a relatively low throughput, which poses a challenge to the high- volume manufacturing cost model for solid core glass substrates. A newly introduced technology for the formation of vias and micro features in thin glass substrates, called laser-induced deep etching (LIDE), has demonstrated to overcome the drawbacks of conventional glass via formation in both, quality and manufacturing throughput. The application of this technology is making the formation of through-glass vias significantly more economical, allowing glass to be considered a more viable alternative as an IC packaging substrate. This presentation describes the advancements in processing technology of laser- induced deep etching to form high-quality and high aspect-ratio through glass vias (TGV) and other micro-features in glass substrates with a thickness of up to 500 m. In addition, the presenter will discuss how this technology can potentially contribute to the manufacturing of other advanced IC packaging applications such as fan-out packaging and photonics integration.
Stephan Schmidt, President - North America
LPKF Laser & Electronics
Tualatin, OR

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