Here is the abstract you requested from the medical_2019 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Advanced Packaging and Materials for Biotech Devices|
|Keywords: Biotech Devices, Materials and Processing, Product Design Roadmaps|
|This presentation will give an overview of the technical, commercial, and project emerging trends of Biotech Devices. The following are key subject areas that will be discussed: - Types of Devices/Modules; Microfluidics, “Lab on a Chip”, Chips with RF features - Range of applications; R+D tools, therapeutic, diagnostic, analytical instruments - Packaging and Interconnection of chips within Devices and Modules - Benefits of OSAT partners; materials, assembly, testing, costing - Application drivers for correct materials selection, functions, interfacing - Mechanical structures, fluidics/channels, non-specific binding, ports, connectors - Optical components, interfacing, sensing and integration - Fluidics design challenges and roadmaps - More roadmaps; Big Data, IOT, RF communication for diagnostics and sensing|
|Vern Stygar; Tim LeClair, Sales Manager
AGC, Inc. ; Cerapax
Rancho Bernardo, CA