Honeywell

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Advanced Packaging and Materials for Biotech Devices
Keywords: Biotech Devices, Materials and Processing, Product Design Roadmaps
This presentation will give an overview of the technical, commercial, and project emerging trends of Biotech Devices. The following are key subject areas that will be discussed: - Types of Devices/Modules; Microfluidics, “Lab on a Chip”, Chips with RF features - Range of applications; R+D tools, therapeutic, diagnostic, analytical instruments - Packaging and Interconnection of chips within Devices and Modules - Benefits of OSAT partners; materials, assembly, testing, costing - Application drivers for correct materials selection, functions, interfacing - Mechanical structures, fluidics/channels, non-specific binding, ports, connectors - Optical components, interfacing, sensing and integration - Fluidics design challenges and roadmaps - More roadmaps; Big Data, IOT, RF communication for diagnostics and sensing
Vern Stygar; Tim LeClair, Sales Manager
AGC, Inc. ; Cerapax
Rancho Bernardo, CA
USA


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