Advanced Technology Workshop on
Additive Manufacturing

September 13-14, 2017
Jackson Center
6001 Moquin Dr, Huntsville, AL 35806

General Chair
Tracy Hudson, U. S. Army AMRDEC

Technical Chair
Robert Dean, Auburn University

Technical Committee:
Janice Booth (AMRDEC); Jeffrey Gaddes (AMRDEC), Phillip Farrington (UAHuntsville), Mike Kranz (EngeniusMicro LLC), Paul Ruffin (Alabama A&M Univ), Mohamed A. Seif (AAMU), Judith Schneider (UAHuntsville), Nima Shamsaei (Auburn Univ), Michael Whitley (EngeniusMicro LLC)

Abstracts Deadline Extended to: July 12, 2017


Workshop Focus:

The International Microelectronics Assembly and Packaging Society (IMAPS) and the IMAPS Huntsville Chapter will host an Advanced Technical Workshop on ADDITIVE MANUFACTURING. Printing technology is expected to enable the evolution of electronics from rigid boards and complex mechanical support structures to products that are flexible, conformal or wearable. The workshop will bring together experts to report on the progress and the challenges of this emerging field. This technology is expected to impact the options for integration of active and passive components and unique mechanical packaging techniques and tooling and will exploit additive approaches to advance microelectronic mechanical system packaging. Conference sessions will cover the development of printable electronic materials, the options for manufacturing/printing, the applications of printed and flexible electronics, and the development of printable mechanical structures and packaging.

In addition to the technical sessions being planned (below), the following keynote presentation has been confirmed:

Keynote - Eric Macdonald

3D Printing of Multi-Functional Structures
In the last decade, research has focused on 3D printing for not only creating conceptual models but functional end-use products as well. As patents for 3D printing expire, new low cost desktop systems are being adopted more widely. This trend is leading to products being fabricated locally and improving supply chain logistics. However, currently low cost 3D printing is limited in the number of materials used simultaneously in fabrication and consequently is confined to fabricating enclosures and conceptual models. For additively manufactured end-use products to be economically meaningful, additional functionalities will need to be incorporated in terms of electronic, electromechanical, electromagnetic, thermodynamic, and optical content. Research has recently focused on embedding electronic components and electrical interconnect into 3D printed structures either by interrupting the process or by inserting the additional content after the structure has been built. However, only until recently and with an investment from the national initiative on Additive Manufacturing – America Makes – has there been a concentrated research focus on developing technology that provides multi-functionality. This presentation will review work in multi-process 3D printing for creating structures with electromechanical actuation and electro-propulsion.

Eric MacDonald, Ph.D., P.E. Friedman Chair for Manufacturing Professor, Electrical and Computer Engineering Youngstown State University Eric MacDonald, Ph.D. is a professor of electrical and computer engineering – with a joint appointment in manufacturing program and is the Friedman Chair for Manufacturing at Youngstown State University. Dr. MacDonald received his B.S. (1992), M.S. (1997) and Ph.D. (2002) degree in Electrical Engineering from the University of Texas at Austin. He worked in industry for 12 years at IBM and Motorola and subsequently co-founded a start-up - Pleiades Technologies, Inc. - specializing in self-test circuitry and CAD software and the startup was acquired by Magma Inc. (San Jose, CA). Dr. MacDonald spent 2003 to 2016 at the University of Texas at El Paso as the associate director of the W. M. Keck Center for 3D Innovation and held faculty fellowships at NASA’s Jet Propulsion Laboratory, SPAWAR Navy Research (San Diego) and a State Department Fulbright Fellowship in South America. His research interests include 3D printed multi-functional applications and closed-loop control in additive manufacturing with instrumentation and computer vision for improved quality and yield. Recent projects include 3D printing of structures such as nano satellites with electronics in the structure (one of which was launched into Low Earth Orbit in 2013 and a replica of which is on display at the London Museum of Science). He has over 50 refereed publications, several patents (one of which was licensed by Sony and Toshiba from IBM). He is a member of ASEE, senior member of IEEE and a registered Professional Engineer in Texas.

Sessions are being planned and abstracts are being requested in the following areas:

Design Tools

Materials & Printing Processes

Printed Devices & Packaging


  • 3D Circuit Layout
  • Modeling and Simulation
  • Shape/Geometry Optimization
  • Cybersecurity/Trusted Data
  • Substrates
  • Conductive inks
  • Dielectric inks
  • Functional Ink Development
  • In Situ Process Monitoring and Control
  • Composite Materials
  • Printing Technologies
  • Metrology Techniques
  • Material Property Gradients
  • Printed Electronics
  • Embedded Electronics in 3D
  • Printed Semiconductors
  • Additive Packaging
  • Heterogeneous Devices and Systems
  • Biomedical Devices
  • Power Storage and Generation
  • Human and Structural Monitoring
  • Printed Antennas and RF Devices
  • Sensors
  • Mechanical Support Structures
  • Space/Stellar
  • Defense

Those wishing to present a paper at the Workshop must submit a 500+ word abstract electronically no later than JULY 12, 2017
, using the on-line submittal form at:

All abstracts submitted must represent original, previously unpublished work. The abstracts should highlight the substrate advancements, materials processing/reliability, design, packaging issues and application. The submission section will aid in grouping the work within these three areas. No formal technical paper is required.

Please contact Brian Schieman by email at if you have questions.

All Speakers are required to pay a reduced registration fee and are required to attend the entire Workshop to maximize opportunities for interaction with registered attendees. All authors and attendees find that this IMAPS Workshop format is a proven forum for informal but highly effective networking between attendees and speakers.

Submit Abstract(s)


Student Paper/Poster Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award cash prizes to the winning student(s). Additionally, out of town students will be considered for $125 travel grants, based on the quality of their abstracts. The selected student must attend the event to present his or her work and receive the award.
The Microelectronics Foundation


Registration Information: (Early Registration Deadline: August 11, 2017) -- REGISTER ONLINE

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentation as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Early Fee
Through 8/11/2017
Advance/Onsite Fee
After 8/11/2017
IMAPS Member
Premier Sponsorship
Includes 1 6-ft tabletopspace, 1 session badge, 1 exhibit badges w/meals, & advertisements

Online Registration - OPEN SOON

Speaker Dates/Information:

  • Abstracts Deadline Extended to:JULY 12, 2017
  • Speaker Notifications Sent: July 21, 2017
  • Early Registration Deadline: August 11, 2017
  • Speaker BIO Due: September 1, 2017
  • Powerpoint/Presentation for WORKSHOP DOWNLOAD file due not later than: September 14, 2017
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up emailed to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)


Hotel Reservations:

THERE IS NO "HOST HOTEL" with this event.
Please check back to see about recommended hotels in the area.




  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems