Honeywell

Advanced Technology Workshop & Tabletop Exhibits on
Additive Manufacturing
& Printed Electronics

September 30, 2019
Hynes Convention Center | Boston, MA
(co-located with IMAPS 2019 Symposium)


General Chair:
Craig Armiento
Professor, Electrical and Computer Engineering, University of Massachusetts Lowell Director, Printed Electronics Research Collaborative (PERC) Co-Director Raytheon-U Mass Lowell Research Institute (RURI)
Craig_Armiento@uml.edu

Technical Committee:
Mary Herndon, Raytheon; Greg Fritz, Draper Labs.


Abstracts Deadline: JUNE 28, 2019

SUBMIT ABSTRACT | REGISTER ONLINE
HOTEL | REGISTRATION | SPEAKER INFO


Workshop Focus:

The International Microelectronics Assembly and Packaging Society (IMAPS) will host a Topical Workshop on ADDITIVE MANUFACTURING and PRINTED ELECTRONICS on September 30, 2019. Printing technology is expected to enable the evolution of electronics from rigid boards to products that are flexible, conformal or wearable. The workshop will bring together experts to report on the progress and the challenges of this emerging field. This technology is expected to impact the options for integration of active and passive components and will exploit additive approaches to advance microelectronic packaging. Conference sessions will cover the development of printable electronic materials (inks), the options for manufacturing/printing and the applications of printed and flexible electronics.


Sessions are being planned and abstracts are being requested in the following areas:

Materials & Printing Processes

Printed Devices & Packaging

Applications

  • Substrates
  • Conductive inks
  • Dielectric inks
  • Functional Ink Development
  • Printing Technologies
  • R2R
  • Chip Integration
  • Embedded electronics in 3D
  • Printed transistors
  • Additive Packaging
  • Batteries
  • Human and Structural Monitoring
  • Printed Antennas and RF Devices
  • Sensors

SUBMISSION:
Those wishing to present a paper at the Workshop must submit a 500+ word abstract electronically no later than JUNE 28, 2019
, using the online submittal form at: www.imaps.org/abstracts.htm.

Please contact Brian Schieman by email at bschieman@imaps.org if you have questions.

Full papers are not required. A post-conference download containing the presentation material as supplied by the presenter onsite will be distributed to all attendees. Speakers are required to pay a reduced registration fee.


Submit Abstract(s)

 

 

 



Registration Information:
(Early Registration Deadline: September 1, 2019)
| REGISTER ONLINE SOON

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentation as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 8/2019
Advance/Onsite Fee
After 8/2019
IMAPS Member
$500
$600
Non-Member
$600
$700
Speaker
$300
$400
Chair
$300
$400
Student
$100
$150
Tabletop Exhibit
Member Price - includes 1 exhibit personnel
$600
$700
Tabletop Exhibit
Non-Member Price - includes 1 exhibit personnel
$700
$800
Premier Event Sponsorship
Includes 1 6-ft tabletop space, 2 exhibit personnel, full-page print advertisement in final program, flyer/giveaway distributed to all attendees, logo/advertisement on event webpages and emails
$1200
$1200

Online Registration Soon


Speaker Dates/Information:

  • Abstracts Deadline Extended to: JUNE 28, 2019
  • Speaker Notifications Sent: July 12, 2019
  • Early Registration & Hotel Deadline: September 1, 2019
  • Speaker BIO Due: September 15, 2019
  • Powerpoint/Presentation for WORKSHOP DOWNLOAD file due not later than: September 30, 2019
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up emailed to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

 


Hotel Reservations:

(Hotel Deadline: September 1, 2019)

The Sheraton Boston is the official host hotel for the IMAPS 2019 housing block. Located in the heart of downtown Boston, the Sheraton is also connected via skybridge directly to the Hynes Convention Center where all symposium programming and exhibits are being held. Book your room today!

Hotel Reservations must be made directly with the official host hotel:

Sheraton Boston
$249/night + taxes and applicable fees
All reservations must be accompanied by a nonrefundable first night room deposit with a major credit card. This deposit will be charged at the time the reservation is made.
Rooms booked under the IMAPS block include complimentary high speed internet access.

Book Online: Click here to book your reservation online.
Book by Phone: Call 1-800-325-3535 and reference IMAPS as your group affiliation.

The discounted room rates are only available until September 1st, or until the room block sells out (and it often sells out early - before the expire dates). Reservations received after the noted deadline or after the room block has been filled may be subject to significantly higher rates. IMAPS room blocks at most hotels historically sell out ahead of the discount deadline, so we encourage you to make your hotel reservations quickly for the best price and availability.

Hotel Scams Alert - The only way to book a room in the official IMAPS Housing Block using the reservations information above. IMAPS does not authorize any other hotel service/group to operate on its behalf.

 

 

 


CORPORATE PREMIER MEMBERS
  • Amkor
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  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic