Looking Ahead!
In my last column I thanked the 2000 Symposium Committee for doing a great job. I wrote that column just as the symposium was ending. We now know that the event was a major success and has helped put IMAPS back on the road to financial recovery. Thanks again to Jim Alexander and his team. We also recently completed a very successful ATW on MEMS and Sensors. This event drew almost 100 attendees to Orlando, Florida.
Looking ahead also promises several more exciting events. By the time this article is published, we will have held the ATW on Future Digital Interconnects above 2001 MHz in Scottsdale, Arizona on January 10-12, 2001. Following that event we will have the Materials Conference in Braselton, Georgia, on March 11-14, a new ATW on Ceramic Based Technologies for the Wireless Communications Infrastructure in Denver, Colorado, on March 26-27, the HD International Conference in Santa Clara, California, on April 17-20, a Thermal Management Workshop in Palo Alto, California, on April 20-22, the Flip Chip Conference in Austin, Texas, on June 18-20, the new ATW on System on a Package (SOP) on June 20-22 in Ogunquit, Maine, and IMAPS 2001 in Baltimore, Maryland, on October 9-11. An Optoelectronics ATW is also being planned for right after the International Symposium. Look for particulars on this activity in the next issue of Advancing Microelectronics.
A couple of these events merit additional discussion. The Ceramic Based Technologies for the Wireless Communications Infrastructure is a new activity that brings the core technologies of IMAPS to the forefront. The wireless industry is one of the fastest growing industries in the world, so dont miss this exciting event. The HD International event is moving to Santa Clara, California, this year, rather than being held in Denver. This conference promises to be a successful joint activity with IMAPS and CMP. And finally, the Flip Chip ATW has grown up into its own stand-alone Topical Workshop. This event, to be held at the Four Seasons Hotel in Austin, Texas, will also have tabletop exhibits.
By the time you read this IMAPS will have moved into its new headquarters in Washington, D.C. Our new address is 611 2nd Street, NE, Washington, DC 20002. The new facility is conveniently located within 2 blocks of Union Station, so getting there from the airport, via the Metro, is very easy. Come visit the staff if you are in town.
Activity is also strong amongst our international chapters. In fact Chapters are being developed in China, Russia and Spain. This continued expansion of our international activity is of major importance to the microelectronics industry as it provides a means for professionals from these areas to interact with their IMAPS U.S. counterparts and foster the growth of the technologies that are the heart of our society.
To maintain our position as a leader in the technological arena, we must continually examine the new breakthroughs, ideas, developments, and applications to identify their applicability to our portfolio of technologies and events. We recently celebrated the 10th anniversary of the ATW program and over those years the new technologies introduced have developed into the Materials Conference, the former MCM Conference in Denver, and the Flip Chip Topical Workshop. We are always looking for new ideas to incorporate into the ATW program. If you have an idea and would like to submit a proposal, contact Jan Vardaman, the ATW Chair, or Wayne Johnson, the VP of Technology.
On a personal note, I would like to extend my condolences to the family of Paul Parks, Sr. Paul recently passed away and you will find a more comprehensive history of his accomplishments in this issue of Advancing Microelectronics. Paul was the President of ISHM in 1987. During 1986, when I was the Vice President of the society, and he was the President-Elect, I had the pleasure of working with him on implementation of several programs of import to the society. He was a dedicated member of the society and he will be missed.
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