European Activities and Calendar of Events
UK:
Business Trade/Industry News:
• WHOOPS!
Just 3 months ago we were reporting staggering upswings particularly in the photonics sector. Indeed we appear to be riding on the big dipper - steeply upwards and a little more gently down but when and how steep will the next upturn be? Certainly the telecomms downturn has produced a raft of casualties - Nortel, Motorola, Cable and Wireless, AVX, Marconi, JDS all shedding jobs on a large scale with the ongoing effect on smaller suppliers into the industry who are making similar sacrifices. Profits are affected with previously buoyant Bookham Technology reporting losses of £11.7m in the first 3 months of the year but probably able to weather the storm due to substantial cash reserves. The likely trend before the recovery is increased R and D activity and more out-sourcing. There are some signs of confidence however with the belief that the UK is better placed to show growth in the engineering sector in spite of the slowdown in the US. The problems of rapid expansion are aptly illustrated by ARC International a UK based microprocessor design outfit which showed a near 160% turnover growth. Now a £4.4m loss compared with the same quarter last year. Scotland where much Microelectronic activity is located is confident that new operations will be attracted into the area such an example being Micro emissive Displays making organic LED micro displays which has attracted another £5m of funding.
The FEI known for its relatively accurate forecasts is predicting around 11% growth in IC revenue this year and the Quarterly Survey of Employment Prospects found 37% of companies interviewed expected to recruit staff as against 11% who expected to discard staff. The prospects for the technology labour force of the future still seems questionable with students maths skills reputably being worse than ten years ago and there also appears to be a shortage of well qualified science teachers though government reports suggest an upturn in applications for training in this sector. The DTI is offering £40m investment in electronic technologies but does it really understand the areas of real need that may not be so politically interesting? A ride on this roller coaster is definitely not for the faint hearted!
BCW
Benelux:
News from the Chapter:
On April 27th, IMAPS Benelux organised its spring event at IMEC in Leuven, on the theme “Reliability of Microelectronic Packaging.” About 50 participants attended the program.
Program:
1. Introduction to reliability engineering by Anton van Putten, AnMar b.v., Eindhoven, NL
2. The application of high precision in-situ techniques in the field of materials & device reliability physics, by Ward De Ceuninck of IMO, Diepenbeek, B
3. Experimental verification of finite-element-modelling (FEM) analysis of packages by Ingrid De Wolf of IMEC, Leuven, B
4. Reliability issues on MEMS Resonators, by Andre Bossche of Delft University of Technology, ITS/EI, Delft, NL
5. Reliability testing of Flip Chip and bonded wafers using scanning acoustic microscopy, by Alan J. Basterfield of Sonoscan, Shaftsbury, England
6. Reliability of automotive components by Willy Sierens of Melexis, Tessenderlo, B
7. Parameterised Modelling of thermo-mechanical reliability for a 5x4 CSP, by Bart Vandevelde of IMEC, Leuven, B
Nordic:
Meetings Programme:
• IMAPS-Nordic 38th Annual Conference, Oslo, Norway, September 23-26.
IMAPS Nordic will be celebrating its 30th Anniversary with a spectacular conference.
The programme is finished and once more you will have superb technical programme surrounded by excellent Tutorials.
The preliminary programme is:
Sunday, September 23, Tutorials:
MEMS and MOEMS Basics, Ken Gilleo
Environmentally Sustainable Electronics, Alan Rae
Monday, September 24:
Keynote, Sensor packaging: The Norwegian Microtechnology Challenge, Sverre Horntvedt, Technical Director, SensoNor
Exhibitors’ Presentations, One single minute each
IMAPS Nordic Annual Meeting, Paul Collander
MEMS and Opto
- MEMS/MEOMS Packaging for 21st Century Products, Chuck Bauer, TechLead Corp.
- Assembly Using Optoelectronic Packages, Alan Rae, Cookson
- MEMS Packaging Issues and Materials, Ken Gilleo, Cookson
RF and Microwave
- RF Radio Links and LMDS Communications
–Module Technology, Status and Trends, Martin Oppermann, EADS
- RF and Microwave Component Development in LTCC, Liam Devlin, Graham Pearson, Jonathan Pittock, Plextek
- Comparison of the RF Electrical performance of the PSGA and the BGA Package, Arun Chandrasekhar, Eric Beyne, Walter De Raedt, Bar Nauwelaers, IMEC
- High Frequency Integrated 3-D Packaging, Richard Dec, Merrimac
High Density Organic Substrates
- A New High Density Interconnect Substrate Technology, ALIVH-C, Masayuki Yamato, CMK
- Environment-Friendly Printed Wiring Boards for Semiconductor Packages, Kazuhito Kobayashi, Hitachi
- Development of the Next Generation ALIVH Substrate, ALIVH-FB, Hideki Higashitani, Matsushita
- Improved Solder Joint Reliability of Flex Based Chip Scale Packages for Portable Electronics Packaging, Denny Aeschliman, Vern Radewald, Douglas Gundel, 3M
Anniversary dinner
Tuesday, September 25:
Lead- & Halogen-Free Electronics
- Leaching of Ag/Pd Thick Film in Lead-Free Solders, Dewei Tian, Terho Kutilainen, Aspocomp
- Evaluation and Implementation of Halogen Free Printed Circuit Board Materials, Martin Valfridsson, Multek
- Low Cycle Fatigue Life of Sn-Ag and Sn-Ag-Bi Lead-free Solder Joints, Cristina Andersson, Xitao Wang, Zonghe Lai, Johan Liu, Chalmers University of Technology
- Reliability Performance of Flip Chip Processing with Lead-Free Solders and Halogen-Free High Density Microvia Substrates, Grant Baynham, Daniel F. Baldwin, Packaging Research Center, Georgia Tech; Katarina Boustedt, Claes Wennerholm, Ericsson Mobile Communications
Ceramics Manufacturing
- Ceramic Circuitry – A Technology for the Future!, Peter Barnwell, Heraeus
- Design and Manufacture of High K Printed Dielectric Capacitors for Highly Integrated RF LTCC Solutions, Chris Barratt, Michael Ehlert, Shaul Branchevsky, National Semiconductor
- Screen Printable Thick Film: An Evergreen and Versatile Technology, John Cocker, Gerard Vanrietvelde, DuPont
Ceramics Applications
- Design of Novel Directional Couplers in Multilayer Ceramic Technology, Sarmad Al-Taei, University College London; George Passiopoulos, Nokia Networks
- High Performance Bluetooth Module Using Flip Chip And LTCC, Johnny Widegren, Einar Martensson, Lars-Anders Olofsson, Ericsson Microelectronics
- Reliability Assessment for Thin Profile Ceramic Bandpass Filters, Juha Jaakola, Juha Väänänen, Filtronic; Jaakko Lenkkeri, Jyrki Ollila, VTT
Flip Chip Reliability
- No-Flow Underfill, A Reliability and Failure Mode Analysis, Michael A. Previti, Peter Ongley, Cookson Semiconductor Packaging Materials
- Flip Chip, CSP and WLP Technologies: A Reliability Perspective, Horatio Quinones, Alec Babiarz, Asymtek
- ACF Flip Chip Joints on Flexible Substrate with Thin and Normal Size Chips, Erja Jokinen, Eero Ristolainen, Tampere University of Technology
- Effect of Different Flex Materials to the Reliability of High Density FCOF (Flip Chip on Flex) Interconnection, Jarmo Määttänen, Petteri Palm, Elcoteq
Buffet Dinner in Exhibition
Wednesday, September 26:
New Materials and Processes
- Recent Research and Development Trend in Wet Process Technology of the Japan Electronics Packaging, Koji Nihei, Waseda University
- Flip Chip Infrastructure and Market Developments, E. Jan Vardaman, TechSearch International
- No Flow-Fluxing Underfill Encapsulants: Process Characterisation, G. Luyckx, Emerson & Cuming
- High Thermally Conductive Underfill for Flip-Chip Applications, Mads Juhl, Osamu Suzuki, Kazuo Muramatu, Toshihide Yuda, Kohei Isobe, Hideki Maruyama, Namics
- Investigation of Shortening Process in SBB Technology, Toshiyuki Kojima, Yosihiro Tomura, Minehiro Itagaki, Kazunori Omoya, Matsushita
Packaging and Wireless
- New-Web Based Design and Collaboration System, Don Brown, International Wireless Packaging Consortium
- Developing the Next Generation Wireless Terminals: Challenges for Packaging and Substrates, Petri Savolainen, Takayoshi Katahira, Nokia Mobile Phones
- MCM-BGA - A Future Packaging Platform, Peter Frisk, Kitron
- Multi-Chip Package Solutions Using Flex Based Substrates, Vern Solberg, Tessera
Wednesday, September 26, Tutorial:
Wireless Communication Developments including RF and Bluetooth, Jan Vardaman
More info can be found on the web: www.imapsnordic.org
News from the Chapter:
• New homepage
IMAPS Nordic has now a new homepage. The webmaster has also modernised its looks – please see the results at: www.imapsnordic.org
Business Trade/Industry News:
• Bluetags, Denmark
Bluetags has developed a Bluetooth based luggage tag, that not only will tell who owns the bag, but also where it is. Bluetags has recently signed an agreement with eBags, USA to supply 20-30M luggage tags.
The tag will communicate with mobile phones or PDAs with Bluetooth modules. Until these phones become public widespread, a RFID (Radio Frequency Identification) version is supplied.
Germany:
Meetings Programme:
• German IMAPS Conference, October 8-9, 2001, Munich
According to the tradition the German IMAPS-Conference 2001 will take place at the Technical University of Munich. Sessions will cover the following topics of microelectronics, packaging or interconnection technology:
• Materials & Technologies (Thick/Thin film, LTCC, Advanced PCBs, MCMs, FlipChip, CSP, COB, SMT)
• Design & Modelling (DFM, thermal/electrical/mechanical simulations, CAD-tools)
• Manufacturing & Processes (HDI-Processing, Large Area Processing)
• Applications (RF/Microwave, Power Packaging, Automotive, Avionics, Advanced Packages, Medical)
• Quality & Reliability (Test and Inspection techniques, 1st/2nd level package reliability, qualification standards)
• Environment (Green materials, Lead free products, Product Recycling, Waste Recycling)
For more details, please contact: Dr. Jens Müller, c/o MSE GmbH, Schlegelweg 17, D-95180 Berg
Phone: +49(0) 9293 78 64
Fax: +49(0) 9293 78 41
E-Mail:
Jens.Mueller@IMAPS.de
Or please use the on-line service at: http://www.imaps.de
• Polytronic 2001, Potsdam, October 21-24
This new joint conference is incorporating Polymeric Materials for Microelectronics and Photonics Application (POLY), Adhesives in Electronics and Polymeric Electronics Packaging (PEP). The main objective is to provide a forum for experts to present their findings and innovations, and to exchange ideas on topics regarding different aspects of adhesives and polymers in microelectronic and photonics. The conference will take place at the Dorint Hotel, located in the historic center of Potsdam near Berlin, Germany.
The Brandenburg state capital, Potsdam, is actually an island in the mid of the picturesque, wooded Havel landscape, close to the metropolis of Berlin. In Potsdam, history can be lived. With the “Edict of Potsdam” of 1685, the Great Elector in practice opened the Mark Brandenburg for settlers from all of Europe. The Dutch Quarter, The Russian Colony “Alexandrowka”, The Bohemian Weavers, Quarter or the churches and villas in the Italian style give the historical townscape an international flair. In 1991 the entire cultural ensemble was declared a part of the world cultural heritage by UNESCO. Our conference hotel is situated between the palace park Sanssouci and the historic town center of Potsdam.
For more information, please use fax number + 49 (0) 30 46403 161; write an e-mail to polyorg@izm.fhg.de or visit the home page http://www.izm.fhg.de/polytronic_2001/.
You are also welcome to contact using mail. Please write to Rolf Aschenbrenner, Fraunhofer-IZM, Gustav-Meyer-Allee 25, Berlin 13355 Germany; phone: +49 (0) 30 46403-160.
Business Trade/Industry News:
• New DuPont global vice-president and general manager
David B. Miller is appointed new global vice-president and general manager of DuPont Electronic Technologies.
In order to strengthen the leadership and increase the focus of its traditional electronic materials businesses, DuPont has appointed David B. Miller global vice-president and general manager of DuPont Electronic Technologies. He will be based at Research Triangle Park, North Carolina, USA.
In his new role, David Miller has assumed responsibility for DuPont¹s High Performance Materials, Microcircuit Materials and Printed Circuit Materials businesses, as well as for the Hitachi-DuPont Microsystems joint venture and the new DuPont-Air Products NanoMaterials joint venture. He is also responsible for the development of the overall growth strategy for DuPont Electronic Technologies.
Dave Miller has many years experience of the global electronics industry. He joined DuPont’s Electronics Department in 1986 and held several sales and marketing positions in DuPont Microcircuit Materials (MCM), before being appointed its global business director in 1994. He then became global business director of DuPont Printed Circuit Materials and later managing director of DuPont Electronics in Asia/Pacific.
In a related move, Harold L. Snyder has been appointed global business director of DuPont Microcircuit Materials, where he replaces Linda B. West.
The DuPont Microcircuit Materials in Europe has its headquarters and technical centre in Bristol, UK and sales offices in Bad Homburg - Germany, Les Ulis France, Milan Italy and Stockholm - Sweden.
Poland:
Meetings Programme:
• IMAPS-Poland 25th Annual Conference
The conference will be held in a very nice mountain resort Polanczyk (close to the International Airport in Rzeszow) on 26-29 September 2001.
The Conference topics include:
• Hybrid and Semiconductor Technologies
• Design Methods and Computer Simulations
• Electronics Materials and Components
• Applications
• Thick-Film and Thin-Film Sensors
• Packaging and PCB
• Quality and Reliability Evaluation
• Thermal Management
• Optoelectronics
• Educations in electronics
• Exhibition of microelectronics circuits, materials, technology and measurement equipment
The Conference language is English.
More information you can find on our WEB page:
http://www.rzeszow.pl/imaps2001
The address for correspondence:
The Technical University of Rzeszow
IMAPS 2001
W.Pola 2, 35-959 Rzeszow, Poland
Fax. (+48 17) 85-420-88,
Ph.: (+48 17) 85-447-08
Or e-mail:
imaps2001@prz.rzeszow.pl
Romania:
Meetings Programme:
• The Romanian Chapter is organising the 7th International Symposium for Design and Technology of Electronic Modules, SIITME 2001. It will take place September 20-23, in Bucharest.
The conference is organised by “Politehnica” University of Bucharest, Department of Electronic Technology and Reliability (TEF) Center of Technological Electronics and Interconnection Techniques (CETTI), Hydraulics and Pneumatics Research Institute Bucharest (IHP).
The general chairman is: Prof. Paul Svasta, Ph.D., “Politehnica” University of Bucharest, Center of Technological Electronics and Interconnection Techniques, Electronics & Telecomm. Faculty.
e-mail:cetti@cadtieccp.pub.ro
For more info, please contact: Dr. Norocel Codreanu, Ph.D. (Symposium Manager),
UPB-CETTI, Splaiul Independentei 313, 77206-Bucharest, Romania
e-mail: noroc@cadtieccp.pub.ro, Tel: +40-1-4116674, Fax: +40-1-4115182
News from the Chapter:
• 24th International Spring Seminar on Electronics Technology - ISSE 2001- Concurrent Engineering in Electronic Packaging, CALIMANESTI – CACIULATA, May 5-9, 2001
Since more than two decades, every spring, scientists from universities and other institutions present their latest results of research and development in the field of electronics technology and the influence of these results to the education of students. The conference is the outcome of continuing inter-university co-operation of Central European Countries, however it extends to worldwide activities. This year professors and scientists from 11countries have participated at the event. Beginning with the present edition, IEEE – CPMT Society is a technical co-sponsor of the ISSE. This gave additional visibility and status to the conference and can result in stronger links, more abstracts submission, and higher attendance in the future.
