New Products
New PACIFIC TRINETICS Introduces New 12” Ceramic Cutter
Pacific Trinetics has introduced a new 12” Ceramic Cutter, CC-7112, that is the latest addition in PTC’s CC-7100 Series Cutting Systems. It can handle sheet sizes up to 12” x 12”. Its guillotine-style cut-head can cut green sheets up to .375” thick. It has direct drives on all its 5 axes of motion. The system uses linear encoders and precision ground ballscrews to ensure higher accuracy and repeatability in its cutting operations. This system comes with CE certification.
For more information, please call 760-603-9000.
New High Frequency Resistor Line from SOTA
State of the Art (SOTA) has introduced a new line of high frequency RF chip resistors. Designated the RF Series, these compact, lightweight resistors are ideal for use in RF and microwave applications. They are available in 14 standard case sizes and have a single surface or wrap around terminations, and a variety of termination materials for solder mount, epoxy bond or wire bond applications. Construction material is either an alumina or beryllia body with a proprietary resistor element for optimum performance.
For more information, please call 214-453-8700.
New Family of Wafers from SSEC
Solid State Equipment Corp. has released its new family of processors, the Trilennium TM 3200 series which are available with up to five processing stations, for maximum throughput or multi-function flexibility. Designed for wafers up to 200 mm in diameter, the systems enable clean, coat, develop, etch and strip processes in a completely dry in/dry out platform, for broad capabilities with optimum precision and uniformity.
For more information, please call 215-328-0700.
S.E.C. Publishes New Brochure
Semiconductor Equipment Corp. has introduced a new four-color brochure that covers the company’s general purpose Model 830 semiautomatic pick and place system for die and surface mount components. The system works with any tape-mounted die removal system. Product features, including optional epoxy die-bonding capability, and their vital specifications are detailed.
For a copy of the brochure, call 805-529-2293.
MicroMax II Dispenser New from GPD GLOBAL
GPD Global introduces the new MicroMax II™ Dispenser that is ideal for heated applications in semiconductor packaging and high density, including flip chip underfill, dam-and-fill encapsulation, and cavity fill. The MicroMax II features X/Y/Z accuracy better than ±0.0015”, and X/Y/Z repeatability less than ±0.0006”. Like all GPD Global dispensers, the MicroMax II employs a real-time multi-tasking operating system using proprietary GPD Global dispensing software displayed in an X Windows format.
For more information, please call 970-245-0408.
MRSI’s New 505 High Frequency Assembly Work Cell
MRSI has introduced its new MRSI 505 High Frequency Assembly Work Cell, a system specifically designed for high frequency applications required for communications, radar, automotive and aerospace. It can be configured for several component-attach technologies including in-situ eutectic bonding, conductive and non-conductive epoxy attach, integrated eutectic bonding in reflow chamber and flip chip bonding.
For more information, please call 978-667-9449.
New Conductive Film-Adhesive from EMERSON & CUMING
An innovative new silver bearing, electrically and thermally conductive epoxy film adhesive from Emerson & Cuming delivers an excellent balance of strength, adhesion and flexibility. The Emerson & Cuming CF 3350 can be used for bonding all types of circuit board materials to metal backplates and heatsinks. CF 3350 can bond high frequency fluoropolymer and ceramic circuits to copper, brass, Kovar and aluminum. In most cases these materials are protected with a gold plate finish.
For more information, please call 1-800-8323-4929.
FANCORT Announces High Temp, ESD Safe PCB Rack
The PC Products Division of Fancort Industries has introduced a new model of its popular RA-14 Rack-All. The new model is molded in a material that is static dissipative with a surface resistivity of 104 – 105 ohm/cm making it ideal for use in handling static sensitive circuit boards. The new material can tolerate temperatures of 400o F for continuous periods of time, and is compatible with most solvents, acids and alkaline chemicals.
For more information, please call 1-888-fancort, ext. 223.
TECAN Introduces Standard-Size Low-Profile RFI Screening Cans
Tecan Components has launched a new range of low profile, standard-size RFI screening cans which are used to control EMI/RFI in microwave and high frequency communications applications. The new range of standard sizes gives circuit designers a quick, cost-effective method of screening sensitive devices and circuits for unwanted EMI/RFI.
For more information, please call 877-99 TECAN.
New Dam and Fill Encapsulant from DEXTER
Dexter Electronics, a division of Loctite Corp., has introduced new dam and fill encapsulant products designed to withstand a 260o C peak solder reflow temperatures with degradation and meet JEDEC Level-3 standards. These high purify liquid epoxies are designed to work together as dam and fill materials for bare chip encapsulation, protecting gold wire bonds and silicon die from mechanical damage, corrosion, and electrical interference.
For more information, please call 716-372-6300.
C.W.PRICE CO. INC. Introduces VERTICAL LIFT
C.W.PRICE CO. INC. has introduced VERTICAL LIFT contact print to its line of MC Series thick film printers. Vertical lift contact print is preferred over peel type contact print for polymers, epoxies, and solders pastes, as well as other printable compositions. The predominant reason is uniform vertical lifting of the mask. The end result is that there are no distorted peaks at the end of the print, unlike peel type printing. For more information, fax us at 908-479-6838.
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