IMAPS 2002 DENVER
FA1
High Density Packaging
Chairs: R. Wayne Johnson, Auburn University; Scott Popelar, IC Interconnect
8 am - 11:25 am
Several innovations in high density packaging technologies including fine pitch packages and their assemblies, surface mount and flip-chip technologies will be presented.
High Density Stacked Packaging Solution for SiP Applications
Vern Solberg, Tessera Technologies
Very-Very Thin Profile Small Outline Package for Memory Card
In-Ku Kang, Sang-Ho An, Jae-Min Kim, Se-Yong Oh, Samsung Electronics
Wirebondability of Electroless Ni/Au Plated Semiconductor Package Substrates
Jaydutt Joshi, Seth Greiner, Conexant Systems, Inc.
Design and Reliability Study of High-Density Memory Modules
Ilyas Mohammed, Young-Gon Kim, Tessera Technologies, Inc.
The Reliability of the 1st Level and the 2nd Level Joint on Flip Chip Package
Eun-Chul Ahn, Ju-Hyun Lyu, Young-Min Lee, Tae-Gyeong Chung, Se-Yong Oh, Samsung Electronics Co., Ltd.
Reliability Challenges of Flip Chip on Organic Substrate
Tae-je Cho, Eun-Chul Ahn, Jong-Bo Shim, Ho-Joong Moon, Se-Yong Oh, Samsung Electronics Co.
FA2
Thick Film II
Chair: Paul Galletta, Teledyne Electronic Technologies
8 am - 11 am
Thick film and thin technology are the base line building blocks for most of the microelectronic devices in existence today. This session will highlight the newer aspects of these technologies and how it can support your needs from D/C to light. These technologies have reinvented themselves to support a whole new series of product lines that meet both the cost and performance needs of those products. Please join us in a lively session that will explore new approaches for this 25-plus-year old technology.
Simulation, Characterization and Design of Embedded Resistors in LTCC for High Frequency Applications
Fred D. Barlow, Gangqiang Wang, Aicha Elshabini, University of Arkansas
Experiences in Obtaining Cross Belt Uniformity of ±1 °C in a 24-inch Wide Thick Film Conveyor Furnace
Fred C. Dimock, BTU International
Copper Electroplating for Thick-Film Power Applications: A Successful Laboratory Method for Prototyping
Khalil Arshak, David Egan, University of Limerick
Insertion Loss of A6 LTCC System up to 40 GHz
Liang Chai, Aziz Shaikh, Vern Stygar, Reinhard Kulke, Ferro Corporation
A Study of Microwave Behavior of a Thin-Print Gold Ink
David J. Nabatian, Chuck Rosenwald, KOARTAN Microelectronic Interconnect Materials
An Imprinting Process for Ceramic HDI Packages
Paul M. Anderson, George Gregoire, Dimensional Circuits Corporation
FA3
Thermal Mechanical and Electrical Modeling
Chair: Li Zhang, National Semiconductor Corp.
8 am - 11 am
Electrical and thermo-mechanical modeling has increasingly become an integral part of robust package design and cost reduction. This session covers papers on CFD simulation of electronic equipment with radiation and convection effects, thermo-mechanical modeling of RF power sensor systems, thermal compact models for IC packages, and electrical simulation for wideband applications, modeling of structures with embedded passives for RFIC applications, and 3D electromagnetic modeling of optoelectronic transceivers.
Linearised Superposition using CFD for Thermal and Power Characterization of Electronic Equipment with Significant Thermal Radiation and Natural Convection
Paul Gauché, Flomerics Inc.; Wen Wei, Intel Corp.
Thermo-Mechanical Simulation and Modeling of RF Power Sensor Microsystem
Jiri Jakovenko, M.Husak, T. Lalinsky, Czech Technical University in Prague
Modeling of Return Loss on Multilayer Package for Wideband Applications
Nansen Chen, Kevin Chiang, Y. P. Wang, SPIL
New Configurations for High Frequency Capacitors and Composite Structures for Embedded Passive and RFIC Applications
Kala Gururajan, Harish Peddibhotla, Raghu K. Settaluri, Oregon State University
3D Electromagnetic Simulation of Optoelectronic Transceiver Structures
John Schultz, Marek Turowski, Robert Trammel, Gordon Henson, 3M Company
The Extraction of a Two-Resistor/Two-Capacitor Model for Common IC Packages and their Implementation in CFD
Sarang Shidore, David Stiver, Flomerics Inc.
FA4
Optoelectronics
Chairs: Phil Zulueta, JPL; Ephraim Suhir, Iolon, Inc.
8 am - 11 am
As the Photonics/Optoelectronics industry continues to experience growth fluctuations, the attempt to find reliable, low cost methods of assembling optoelectronics remains a primary focus among researchers, technologists and package-developers. This session in Photonics/Optoelectronics Packaging reflects this theme as it addresses work, ranging from novel adhesive and process technologies for fiber alignment and VCSEL assemblies to the development of new glasses for planar, optical waveguides.
Curing Low Yields and Reliability Issues in Photonics Assembly
Mike Martuscello, Lambda Technologies
An O/E Measurement Probe Based on an Optics-Extended MCM-D Motherboard Technology
Herbert DePauw, J. De Baets, J. Vanfleteren, A. Van Calster, Ghent University (ELIS-TFCG) / IMEC
Characterization of Adhesives for Low Temperature Microelectronics and Photonics Packaging
Curtis Taylor, Hameed Naseem, William Brown, University of Arkansas
Adhesive Assembly for Optoelectronic Transceivers
John Schultz, Ron Davis, Glen Connell, Gordon Henson, 3M Company
An Optimized System Solution for an Opto-electronic Transceiver Module
Abdolreza Langari, Hassan Hashemi, Mindspeed Technologies Inc.; Winfred Morris, Rockwell Scientific Company
Planar Optical Waveguides Fabricated by Ion-Exchange of Transition Metal Ions in Commercial and Special Optical Glasses
Jarmila Spirkova, P. Nebolova, P. Nekvindova, M. Mika, A. Mackova, G. Kuncova, A. Langrova, K. Mach, J. Schrofel, Institute of Chemical Technology
Special Session*
8 am - 10:35 am
FA5
National Science Foundation & Sidney J. Stein Educational Foundation
Chairs: Rao Tummala, Leyla Conrad, Georgia Institute of Technology
DC Resistivity Profile of Multilayer Dielectric Devices for Production Process Improvement
Aaron E. Hydrick, Alfred University
Surface Preparation of AlN Substrates for Metallization
Robert Campman, The New York State College of Ceramics at Alfred University
Fabrication of a Pressure Utilizing Low Temperature Co-fired Ceramics
Yasmin Morales, Boise State University
Finite Difference Time Domain Simulation of Multiport Networks using S-Parameter Macromodels for Packaging Applications
Chris Lasek, University of Colorado at Boulder
Chip-Package Co-design of RF Microsystems
Leroy Griffith, Rochester Institute of Technology
Denver has some of the finest museums in the West; with a wide variety of historical, western, artistic and horticultural emphasis.
The Black American West Museum tells the forgotten story of African American cowboys, who made up as many as one third of all the cowboys on the great cattle drives. Housed in the home of Dr. Justina Ford, Denver’s first African American doctor, the museum has exhibits, historic photos and artifacts that tell the story of the many contributions made by Blacks in settling the West. (303) 292-2566.
Buffalo Bill’s Grave & Museum is filled with memorabilia honoring the famous frontier scout, showman and Pony Express rider, William F. Cody. A beautiful view of the mountains and the plains is visible from his grave site. (303) 526-0747.
Butterfly Pavilion & Insect Center features a lush tropical forest filled with up to 1,600 free-flying butterflies. There is also an insect center and gift shop, as well as outdoor gardens and many fun, educational exhibits. (303) 469-5441.
The Children’s Museum of Denver is a unique participatory museum for children and families to experience hands-on, interactive exhibits and activities. (303) 433-7444.
The Colorado History Museum offers a series of dioramas and exhibits that trace the colorful history of the Indians, explorers, gold miners, cowboys and pioneers who have called Colorado home. Exhibits include an outstanding collection of William Henry Jackson photos and a large diorama of Denver as it appeared in 1860. Call for information on special exhibits. (303) 866-3670.
Colorado Ocean Journey, which opened in June, 1999, is a world-class aquarium that immerses visitors on two journeys, from the Continental Divide in Colorado to Mexico’s Sea of Cortez, and the other from an Indonesian rain forest to the Pacific Ocean. The Rocky Mountain West’s only aquarium will also show visitors how all water and water life are inter-related. (303) 561-4450.
The Colorado State Capitol stands a mile above sea level with a plaque on the 15th step to mark the spot that is 5,280 feet (1,609 m) high. The dome is covered with 200 ounces of pure gold and offers a beautiful view from the rotunda of the entire Front Range, from Pikes Peak, all the way north to the Wyoming border, a distance of over 150 miles (241 km). Free tours on weekdays of the beautiful rooms and appointments. (303) 866-2604.
Coors Brewery offers free tours of the largest single brewery in the world. Free tours of the entire complex, from brewing to bottling, with free beer samples for those over the age of 21. (303) 277-2337.
Denver Art Museum has what is considered to be the finest collection of American Indian art works in the world covering all tribes, as well as 30,000 other art objects in seven curatorial departments. It is the largest art museum between Kansas City and the West Coast. (303) 640-2793.
Denver Botanic Gardens has a large conservatory, an alpine garden with rare tiny flowers, a Japanese tea garden, as well as a water garden with hundreds of water lilies that bloom in late summer. It is just one of 506 public gardens in Denver where over 240,000 flowers are planted each year. (303) 331-4000.
Denver Museum of Nature & Science is the fourth largest museum of its kind in the nation, with over 80 dioramas depicting animals from around the world. It also features an outstanding dinosaur collection, a Hall of Life devoted to studying the human body, a planetarium, an outstanding geological collection and an IMAX theater. (303) 370-6310.
Denver Zoo is consistently rated as one of the top 10 in America with 3,500 animals in lovely spreading grounds in City Park. “Tropical Discovery,” is a 1.5-acre rainforest under glass in which visitors feel the sensation of walking through a jungle teeming with wildlife. (303) 376-4800.
Six Flags Elitch Gardens Theme Park is a hundred-year-old theme park known for its European atmosphere, elaborate floral gardens, and thrill rides. In 1995, Elitch Gardens moved to an expanded location in downtown Denver along the South Platte River with all new rides, gardens, lagoons, restaurants and amusements. (303) 455-4771.
The Molly Brown House honors “Unsinkable Molly Brown,” the heroine of the Titanic disaster with mementos from her life preserved in her beautiful home on Capitol Hill. Molly was one of the most colorful characters to come from Denver’s gold rush period. While sailing on the Titanic, she took command of a lifeboat and was credited with putting down a panic. Her life story was the inspiration for the hit musical and film, “Unsinkable Molly Brown.” (303) 832-4092.
Tiny Town is a kid-sized village with dozens of “Old West” buildings, all built at 1/6 scale in a scenic mountain location. An authentic toy steam locomotive circles the park giving children and adults a ride past the miniature town. (303) 790-9393.
The U.S. Mint is where over five billion coins are made each year and there are free 20 minute tours on weekdays. It is also the second largest storehouse of gold bullion in the U.S. after Fort Knox. The gift shop has many unique coins not available anywhere else, and there is a small museum on the history of money. (303) 844-3582.
