IMAPS ICAPS '02
Welcome to this issue of
Advancing Microelectronics describing the program for the International Conference on Advanced Packaging and Systems (ICAPS ‘02)! This new conference is primarily focused on advanced electronic systems and the advanced electronic packaging used in these systems. Our goal is to make this the premier conference for systems developers and electronic packaging suppliers while keeping the conference small enough for meaningful interaction amongst the attendees. The main objective of ICAPS is to get the systems and packaging developers together in one conference. This will enable the participants to learn about the latest industry advances in systems and packaging technologies as presented by industry leaders. Attendees will also be able to interact, with industry experts, to exchange information and find solutions for their needs. The second objective of ICAPS is to bring together the industry leaders in advanced systems and packaging to exhibit the latest technologies under one roof. The third objective is to offer Personal Development Courses by industry experts to expose our industry practitioners to new areas and increase their skills.
Topics to be covered in the conference are System Applications, 3D Packaging, Design and Test, High Density Packaging Materials, Thermal Management, High Density Packaging, Reliability, MEMS Packaging, Advanced Substrates and Lids, and Power Packaging. In addition, there will be a Plenary Session on Folded Flex and Thinned Silicon Multi-Chip Packaging with six papers over two days.
The choice of Reno, Nevada, provides a cost effective location with entertainment for all attendees and spouses. It’s a short distance from Silicon Valley allowing participants to save money and still be able to conduct business if needed.
This issue of Advancing Microelectronics contains two papers that would be typical of the papers presented at the ICAPS conference. The first paper by Zhenwei Hou (et al.) is the Best Paper from last year’s HD International Conference that also had an Advanced Systems and Packaging content. This paper focuses on the current environmental need to remove Pb in electronic assembly processes and using Sn-Ag-Cu. While no “drop-in” solder alloy has been found for eutectic Sn-Pb, this paper does examine an alternative and the issues associated with this choice of materials including reliability.
The second paper, by David Liu (et al.), examines using Laser Direct-Write Technology for the rapid fabrication of a broad range of micro devices and circuits at lower temperatures and cost. This technology is capable of producing mesoscale (2 to 100 um) features using an “all-in-one” laser tool. The laser tool is capable of multiple material depositions, sintering, and micromachining without moving the substrate from the system. The processing temperatures are low (200-300C) and the laser head speeds are of the order of 1m/sec. Multilayer structures can be made in the same tool and design changes are quickly done by editing the software design files. The ability to create Integrated Passives and trim circuits for performance using this technology may be very useful for wireless and RF applications where quick turn around times have been a barrier to development and implementation.
I think you will find these papers educational and stimulating. Today’s economic challenges require us all to be motivated to find the best ways to satisfy our customer’s needs. ICAPS ’02 provides a forum to examine the best in Advanced Systems and Packaging technologies and find the right solutions. As the General Chair, let me ask you to please join us ICAPS ’02 in Reno, Nevada, for this industry event!
Timothy G. Lenihan is a Senior Consultant at TGL Consulting in Rochester, New York. He received his Ph.D. in Electrical Engineering from the University of Arkansas in 1996. During his career he has worked at IBM in the East Fishkill Technology Park where he held managerial positions in the semiconductor and packaging development areas. Dr. Lenihan held the position of Director of Technology and Director of Sales and Marketing for Sheldahl, Inc. in Longmont, Colorado. More recently, he was the CTO and Senior Vice-President of Engineering and Quality for Zecal Technologies Incorporated. Currently, he is consulting in the areas of Electronic Packaging and Integrated Passives.
Dr. Lenihan is a Senior Member of the IEEE, member of IMAPS, and a member of the New Academy of Sciences. He is also an Adjunct Professor in the Department of Electrical Engineering and the High Density Electronics Center at the University of Arkansas.
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