IMAPS - International Microelectronics And Packaging Society

Advancing Microelectronics • Volume 29, No. 2 • March/April, 2002

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Professional Development Courses - Sunday, March 10

PDC1:

IC Packaging Trends and Assembly Options - Technical Issues and Concerns

9 am – 5 pm

Bill Greig, Greig Associates

Description:

This course addresses the impact of both the Integrated Circuit, and End Product requirements, in particular, “smaller, better, cheaper,” on packaging, assembly, and substrate interconnects. It focuses on packaging trends, namely, the Ball Grid Array (BGA), and the Chip Scale Package (CSP), and alternative formats, multichip modules (MCM), chip on board (COB) and 3-D initiatives at both the chip and package levels. Assembly options available for attachment of the IC in each case will be discussed with major emphasis on Flip Chip. The course also covers High Density Interconnect substrates (HDIs). The various substrate technologies (Thick Film, Co-fired Ceramic, and Thin Film) that are employed in the manufacture of Single Chip and Multichip Packages will be reviewed. And finally, the latest developments in PWBs, with high density, fine lines, and micro vias employing sequential processing (Build Up Technology – BUT) will be reviewed. Throughout the course the technical issues will be emphasized and reliability concerns addressed where appropriate.

Who Should Attend?

The course provides a comprehensive overview of microelectronic packaging and assembly and is intended for individuals in any way involved with electronics manufacturing. Discussing current and future trends, it is directed towards both the experienced or inexperienced engineer and technician and management personnel with the “need to know.” It should also be of particular interest to those in support activities such as procurement, quality assurance, marketing, sales, and program office will greatly benefit from this course.

Special Course Material:

All attendees will receive a complimentary copy of the book, Hybrid Microcircuit Technology Handbook, J. Licari, L. Enlow, 2nd Edition, Noyes Publications, 1998.

Instructor Bio:

Bill Greig is currently an independent consultant specializing in microelectronic packaging and assembly. His previous work experiences include RCA Semiconductor, General Electric Co., Lockheed Electronics, and NASA. His areas of expertise covers semiconductor wafer processing, hybrid circuit manufacture, printed wiring board fabrication and assembly technologies such as chip & wire and flip chip. He has presented numerous courses at national symposia and has participated in CEE programs at U. of Wisconsin, Lehigh University and Rutgers University. He is a member of SMTA and IMAPS and is currently President of the Garden State Chapter.

PDC2:

Practical Methods to Design-In and Predict Surface Mount Attachment Reliability

9 am – 5 pm

Robert W. Kotlowitz, Lucent Technologies/Bell Laboratories

Description:

The long-term reliability of surface mount (SM) solder interconnections remains an important issue in advanced electronics packaging technologies. The development of high-reliability SM circuit assemblies requires an understanding of the key reliability challenges and controlling design parameters. This intensive one-day course describes the reliability hazard for SM connections and presents practical methods for SM attachment reliability assurance. These risk-mitigation processes support the needs of the electronics packaging R&D community, by providing robust design strategies without requiring a detailed understanding of complex SM reliability issues.

Who Should Attend?

This course will directly benefit researchers, practicing engineers, and managers responsible for:

SM component design
Advanced electronics packaging R&D
Mechanical, electrical, and RF design of circuit boards and wired equipment
SM interconnection reliability assurance
Product assurance
Accelerated stress testing
SM assembly
Supplier reliability management for out-sourced wired equipment

Instructor Bio:

Robert W. Kotlowitz, Ph.D., is a Distinguished Member of Technical Staff in the Wireless Networks Group at Lucent Technologies/Bell Laboratories in Whippany, New Jersey, USA. He joined AT&T Bell Laboratories in 1982 and transferred into Lucent Technologies in 1996. Dr. Kotlowitz is a technical specialist and internal consultant with responsibility for advanced electronics packaging, SM component strategy, mechanical design support, product qualification, reliability assurance, and supplier reliability management. He is actively involved in SM interconnection reliability assurance in telecommunication equipment, SM manufacturing process qualification, and accelerated stress testing for product assurance.

Dr. Kotlowitz has authored technical papers on SM attachment reliability assurance, advanced packaging, and accelerated stress testing that have been presented at major electronics packaging and reliability conferences in the USA and Europe. These industry forums include the International Microelectronics And Packaging Society (IMAPS) Symposium, International Electronics Packaging Society (IEPS) Conference, National Electronic Packaging and Production Conference (NEPCON), IEEE Electronic Components and Technology Conference (ECTC), Surface Mount Technology and High Density Electronics Packaging Exposition (Expo SMT/HiDEP), Surface Mount Technology Conference and Exposition (SMTCON), Inter-University Micro-Electronics Center (IMEC) Program in Packaging for Electronic Systems (Belgium), Wireless Circuits, Interconnection, and Assembly Workshop, ASME Electrical and Electronics Packaging Division, IEEE Accelerated Stress Testing (AST) Conference, and IEEE Transactions on Components, Hybrids, and Manufacturing Technology (CHMT). The initial published work on lead compliance evaluation for SM assemblies received the Best Paper Award for the 1987 IEPS Conference.

PDC3:

Microelectronic Thermal Management

9 am - 5 pm

Al Krum, Consultant

Description:

This course will provide an introduction into the thermal management of microelectronic components and assemblies. It will address the various packaging approaches available for single chip, hybrid, MCM and circuit card assemblies. This course starts off with the selection of the materials used in various components. Semiconductors, die attach, substrates, packages, package attach and circuit cards are covered in detail. Tradeoffs in cost, performance and producibility are addressed. Quantitative methods for determining heat generation in both active and passive components will be presented. Complete thermal analysis is both time consuming and CPU intensive.

This course will provide techniques for doing first order thermal modeling without the need for heavy math. In this rapid modeling technique, the material choices and heat path design can be narrowed down so that subsequent detailed thermal analysis can be more productive. Techniques for decreasing junction temperatures will be presented with an eye on cost and producibility. Heat spreaders, thermal vias, fans and blowers will be covered. Methods of measuring thermal resistances and thermal conductivity will be presented. For extremely high power density components, exotic cooling techniques are required to minimize junction temperatures. Micro-channel cooling, thermoelectric coolers and heat pipes are some of the techniques that will be discussed. The trends in thermal management of microelectronics will be addressed with an emphasis on new materials and processes.

Who Should Attend?

This course is recommended for engineers, physical designers, project managers, manufacturing personnel, and quality and reliability engineers who are interested in obtaining a firm understanding of the thermal design of microelectronic assemblies without the rigor of the heavy math usually associated with thermal analysis.

Special Course Materials:

Each student will receive a copy of Thermal Management Handbook for Electronic Assemblies by Jerry Sergent and Al Krum, McGraw Hill, 1998 (List price $90), as well as course notes.

Instructor Bio:

Al Krum is a consultant to the microelectronic packaging industry. Previously he was a manager at Raytheon Electronic Systems (formally Hughes Aircraft Company) with over 30 years of experience in the design, test and manufacture of microelectronic modules. He has lead the design and development of over 200 hybrid circuits including over 50 power hybrids. A much sought after lecturer, Mr. Krum is the author of numerous papers in the field of hybrids and holds four patents. He is an author and coeditor of the Thermal Management Handbook for Electronic Assemblies. In addition, Mr. Krum has written the thermal management chapter in the 3rd edition of Electronic and Packaging Interconnection Handbook. He teaches classes on power hybrids for the University of California Extension and at the IMAPS national symposium. He received his B.S.E.E. and M.S.E.E. from Newark College of Engineering.

PDC4:

Implementing Microvias and Embedded Passives

9 am – 5 pm

Rolf E. Funer, Funer Associates

Description:

New PCB designs are increasing in density and requiring more and more component placements, more I/Os, tighter dimensions. Microvias can dramatically reduce board size, increase I/O count and reduce layer count. The numbers of passives, resistors and capacitors are increasing dramatically. By embedding the passives directly in the circuit board, valuable surface area can be saved. And performance, particularly at high frequency, can be improved. These new technologies can work together to cut weight and size and therefore enable high density substrates. But can these concepts be implemented today? Or are they future technologies? This workshop addresses these issues, reviews all the currently available materials and processes to make microvias and embed passives. Design and testing issues, performance, reliability, applications and economics are all covered. The design and project managers attending this course will come away with an informed view if their designs are ready for microvias and embedded passives and if microvias and embedded components are ready for them. PCB manufacturing and development engineers will learn what they will need to do to implement these technologies.

What You Will Learn:

Major microvia processes: their capabilities, costs, reliability and availability
Applications of microvias to reduce size, layer count and cost
Suppliers: US and worldwide
Embedded passives: currently available materials. How to processing, their capabilities, benefits and limitations
New and emerging materials: their status and potential
Applications and how they are working out

Instructor Bio:

Rolf E. Funer is currently a consultant to the electronic industry. His clients include components manufacturers, electronic materials, test instrument and circuit suppliers. He retired from AMP Corporation as Chief Technologist, Circuits and Electronic Packaging. Previously he was Technical Director for Carolina Circuits, an AMP subsidiary. Dr. Funer spent 5 years with ICI where he was Technical Director of its Electronics Division, where the new concepts of molded circuits and high-density plated ceramic circuits were developed. Earlier, Dr. Funer worked at DuPont Company for 18 years in various electronic materials research, development and marketing positions. Dr. Funer holds a Ph.D. in organic chemistry from the University of Wisconsin and a BS degree in chemistry from Loyola University.

THINGS TO DO IN RENO!

Brookside Golf Gourse
This nine-hole course is adjacent to the Reno/Tahoe International Airport and was originally designed by a group of doctors in 1956. This is great place to go during lunch hour, play nine holes, and be back in the office before anyone notices you’re gone. The par-35 course with 2,882 yards makes for an easy round. Greens fees are $18, carts $20. Fees may go up $1 during the summer months. No reservations necessary for tee times.

Addi Galleries Reno
You will not find a better place to shop for fine art in Reno. Gallery director Winifred Addi knows her stuff. She has extensive art education at Ecole de Louvre and Sotheby’s American Arts. You will find works of more than 200-artists including Salvador Dali, Marc Chagall, Fredric Remington and Red Skelton. One could easily spend hours browsing in this fine gallery conveniently located at the Reno Hilton Hotel Casino.

Ultimate Rush
Just imagine yourself being harnessed securely to a thick wire cord and slowly raised 180 feet in the air, then released. ZOOM!! You go flying through the air at an incredible speed and swing back and forth until you finally slow down and stop. What an incredible rush you will feel! This cool thrill ride is a combination of skydiving, bungee jumping and hang gliding. Take this thrill-of-a-lifetime ride, and your trip to Reno will indeed be memorable. The cost is $25 per daredevil.

Reno Hilton Bowling Center
This neat bowling facility offers you 50-championship synthetic lanes with state-of-the-art automatic scoring. This is a great place for the entire family to come spend a day of fun that should be right up your alley. Bumper bowling is available upon request. There is also a snack bar, video game room and a full service lounge with your favorite cocktails. Prices are $2.40 per game 8am-6pm, $2.95 per game 6pm-midnight, and $1.80 per game for graveyard bowling. Shoe rental is $2 per person.

Snowind Sports
Located pool-side at the Reno Hilton Hotel, this convenient store rents bikes, skates, snowboards and skis. You’ll get personalized service and the best boot fitting in town. Bauer in-line skates are featured. Rental rate for bikes start at $8 per hour, $15 half-day, and $25 all day. In-line skate rentals start at $5 per hour, $10 half-day and $15 all day. Ski rentals range from $20-$28 and snowboard rentals $30 per day.

Hilton Bay Aqua Driving Range
This is a great place to bring the whole family. During the summer months, the natural bay is a cool place to hang out and people-watch, bird-watch or coach your loved ones while they practice. Even in winter, die-hard enthusiasts will practice their golf swing until the lake freezes over. Club rentals are available at $5 per club, and a basket of balls starts at $3.

Fun Quest
Never-ending fun is what you will find at this incredible 40,000 square foot fun center, which features a wide array of activities and games for the entire family, including more than 200 of the latest most exciting video and redemption games.

For those of you who like to get a little physical, the place offers magnetic bumper car rides for $2, as well as Reno’s first interactive laser tag arena, which houses a dynamic live action, high-tech game of hide-and-seek for a cost of $6. This 5,000-square foot futuristic arena comes complete with music and special effects to make it both physically and mentally challenging. A batting cage and power pitcher for baseball simulation is also featured. For children ages one through eight, there is The Galaxian Theater and Tumble Town. Your tots can play here safely for $2.

There is a $2 charge for admission on Friday, Saturday and holidays. You will be given the value of admission in tokens for the arcade. There is also a charge for individual attractions and games. All-day wristband passes are available for purchase.

For more information on Reno,
visit info@cityofreno.com

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