High Performance Adhesive Film from EMERSON & CUMING
Emerson & Cuming’s 5020K thermally conductive adhesive is ideal for assembling microwave components and modules. This glass fabric supported film has excellent dielectric properties and adhesive bond strength is outstanding, especially to gold surfaces.
For more information, please contact 1-800-832-4929.
SSEC Digital Sealing Lowers Cost
Solid State Equipment Corp. has increased seal yield and lowered costs with the Model Nte one-shot welder. A PC controlled power supply and one-up seal tooling characterize this new tool, designed for precision and production capability and quality.
For more information, please call 215-328-0700.
Lead-Free Flip Chip Bump Alloy from KULICKE & SOFFA
K&S’s Flip Chip Division has developed a new ultra-pure, lead-free alloy that has provided data indicating greater reliability and the lowest alpha emissions form flip chip solder joints ever recorded by the company. The lead-free Sn/Ag/Cu alloy, designated LF-2 was qualified by several integrated device manufacturers and original equipment manufacturers.
For more information, please call 215-784-6000.
New FURON® Inline-1000 Molded High Flow Valve from SAINT GOBAIN PERFORMANCE PLASTICS
Created especially for use in high purity/corrosive chemical applications including semiconductor valve boxes, chemical delivery, and chemical processing, the new injection-molded Furon® In-Line-1000 Valve from Saint Gobain Performance Plastics combines maximum flow performance with space-saving economy.
For more information, please call 714-238-2372.
PREMIER MILL Laboratory/Pilot Plant Supermill
Premier’s Laboratory/Pilot Plant Supermills are unique because they offer all the advantages of larger production size units but are compact and rugged enough for pilot plant testing. These pilot plant mills are specifically designed for small product runs that require continuous dispersing and particle size reduction.
For more information, please call 610-779-9500.
THERMOSET’s New Low Thermal Resistance, Low Stress Adhesive T-315
Thermoset, Lord Chemical Products has developed an innovative thermal interface material – MT-315. This low stress adhesive has a bulk thermal conductivity of 7.3 W/mK and can achieve bond thicknesses of 1.5 to 2 mils.
For more information, please call 317-259-4161, ext. 282.
LOCTITE Introduces Phased-Reflow Anti-Tombstoning No Clean Solder Paste
Loctite Corp. has introduced the new Loctite® Multicore® 63S4 RP-15 no clean solder paste. The paste has been formulated with the unique 63S4 alloy that eliminates costly tombstone defects that occur when reflowing boards with small components.
For more information, please call 860-571-5100.
SONOSCAN’s AW2000 System
Early reports have confirmed that the AW2000 automated bonded wafer acoustic imaging system finds and images voids and other defects as small as 5µ in diameter between bonded SOI wafer stacks. Suitable for anodic, intermediate, and direct bonding methods, the AW2000 has been established as a primary tool in increasing yield in bonded wafers to the very high levels needed for profitability.
For more information, please call 847-437-6400.
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