European Microelectronics
Conferences, Co-operation, Dissemination....
First of all, I welcome you to the International Technologies issue of
Advancing Microelectronics. One time a year we have a full magazine dedicated to International technologies, programmes and activities. The reason for the timing is that the European IMAPS Conferences or Symposia take place in May/June.
Talking about conferences, I have myself attended quite a few International conferences this year organised by colleagues from SMTA, IEEE and of course by IMAPS (US and UK).
What is quite clear is that we all are still facing difficult times. Only one event — and a brand new one – the ICAPS (International Conference on Advanced Packaging and Systems), actually exceeded expectations. All other events had a difficult time in spite of very good technical programmes. Some explanations for success or not, I could give, could be the marketing (effective or sloppy), the location (“nice place,” easy access), a known “history” (good programme, good networking possibilities, effective organisation, value for the money) and finally of course the total cost. Some of the conferences with red figures had taken place at hotels, quite expensive (i.e. 150-200USD/night).
I do not buy explanations related to travel restrictions any more and we ought not accept excuses as slow times. Especially when the activities are not at 150% speed, the companies should utilise the time, and focus on the continuous education of their development and production guys to prepare for the busy times coming up. At that time the levels of skills and experience could be the decision factor for the customer choosing a product or supplier. I am aware of subcontractors using this interim period to qualify themselves in handling and understanding flip chip assembly and its issues. They have purchased flip chip evaluation boards and flip chips and are testing out their assembly capabilities. Together with the dispensing equipment makers they practice underfilling of the assembled boards. I sure hope that the future potential customers will reward this.
Coming back to the conferences, it is quite clear that the organiser or the event with a good “history” has an advantage. They are known to offer not only a good technical programme, attractive exhibition, and the best possibilities for socialising and networking at good hotels — still with the option left to delegates to find alternate (cheaper) housing if required.
Exactly this was offered at ICAPS in Reno. The staff did a perfect job and the organiser and general chair had made an arrangement with welcome reception and lunches included that kept people in the exhibition area and created a very good ambience for networking.
If we cannot merge the various societies and reduce the large number of interesting conferences, we delegates must show the organisers what we want and what we need.
This once more could demonstrate the role of IMAPS in disseminating information on the technologies of interest for its members – but also just as important demonstrate IMAPS’s role in enabling the perfect conditions for networking and in the creation of new, friendly relations.
I believe we in Europe have learned the lesson and I gladly invite you all to the next European IMAPS event in June, when our friends from the IMAPS-Poland chapter host the European Microelectronics Symposium in the beautiful city of Cracow. Here you will feel the hospitality and you will experience that technology and friendship go hand in hand.
The technical papers from Europe selected for this issue will illustrate for you some of the important activities from the environmental regulations over automotive lead-free reliability issues to activities with embedded, thinned silicon.
In the “European Section” you will also find interesting info on two new EU-funded technology programmes, one of them dealing with wafer thinning possibilities and applications.
Happy reading — and see you in Cracow!
Søren Nørlyng
noerlyng@micronsult.dk
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