Book Reviews – Jerry E. Sergent, Ph.D.
“Environmentally-friendly Electronics: Lead-free Technology”
by Jennie S. Hwang, Electrochemical Publications Ltd., 2001
Jennie Hwang’s book, “Environmentally-friendly Electronics: Lead-free Technology,” has much in common with her other books: it is very complete, it is up-to-date, and it has something for everyone. Lead-free technology is an idea whose time has come, and Jennie provides, in a single 879-page volume, virtually all the relevant information available on the topic.
Stressing the relevance of the topic, the Foreword is by two U.S. Congressmen, one Democrat and one Republican. The book begins with the impetus for lead-free materials, the environment, and proceeds to a discussion of the related legislation. The technical aspect of the book starts out with a discussion of industry trends and packaging and the fundamental technology of both lead-based and lead-free solders. She also provides a comprehensive list of patents dealing with lead-free systems.
The bulk of the book consists of data on a variety of lead-free systems, including binary, ternary, quaternary, and pentanary systems. In all, over 40 systems are discussed in detail. For completeness, a chapter on conductive adhesives is provided as well, presenting data on lead-free adhesives, applications, and a comparison with the solder technology.
From there, she proceeds to a discussion of the manufacturing considerations, including the effects of the component leads and PC board finish. The reflow process, including the effect of fluxes and temperature profiles, is discussed as well. A treatise on the design of experiments provides a means to fully select and qualify materials and processes. One chapter deals with inspection and machine parameters alone. Reliability data for several systems based on studies by Delco and Sandia Labs is also given, along with the effects of lead contamination.
As a finale, the experiences of industry leaders, such as Hewlett-Packard, Kester Solder, and Ford Electronics are presented first-hand. A comparison of some of the more common lead-free systems and processes is provided, along with recommendations for materials and processes.
Lead-free solder is a topic that affects everyone in the electronics industry, and, as I mentioned, there is something for everyone in this book, from the scientist who originally formulates the solder, to the engineer who must process it, to the operator who must inspect the finished product, to the OEM who must be responsible for the quality of the product, all the way to the end user who must be happy with the result. This is both a reference book and a how-to book that should be on the shelf of everyone who is involved with the electronics industry.
