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Preliminary Programme
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SUNDAY, 16th JUNE 2002
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| 1400 - 1730 |
SEMINAR
Critical Aspects in Developing Multiple Die Assemblies
NATIONAL SEMICONDUCTOR CORPORATION
by Mark Lippold, Mark McClintick and Mike Ehlert
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| 1900 - 2200 |
Welcome Reception
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MONDAY, 17th JUNE 2002
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| 0900 - 0915 |
Opening Ceremony
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Plenary Session I
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| 0920 - 0955 |
Invited paper 1: The State of Electronic Industry in Poland,
Wieslaw Marciniak (Poland)
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| 0955 - 1040 |
Invited paper 2: Device Packaging in the Year 2020,
Charles Bauer (USA)
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| 1040 - 1120 |
Coffee Break
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Parallel Sessions
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| 1120 - 1320 |
Session 1:
Packaging and Interconnection (Part I)
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Session 2:
New Materials
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Thermal Characterization of Flip-Chip Connected SiGe Devices: Experimental Data and Simulations
C. Bassani, F. Grazziani, G.M. Langiu (Italy) |
Compliant Photopatternable Silicones
J. Alger, S. Dent, G. Gardner, B. Harkness, L. Larson, R. Nelson, E. Vanlathem (Belgium) |
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Flip-Chip Bumping and Redistribution Overview
D. Wojciechowski, E. Blansaer (Belgium) |
Advantages and New Developments of DBC (Direct Bonded Copper) Substrates
J. Schulz-Harder |
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Stress Interposers, the Other Path for Interconnecting Grid-Array Components, or the "Tolerant" and Dismountable Electronics
M. Massena, P.-J. Albrieux (France) |
Integration Microwave Bandpass Filters Based on High-Temperature Superconducting Films for Extreme Working Conditions
Korotash, M. Lorenz, E. Rudenko, T. Stepanova (Ukraine/Germany) |
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Advances in Aligned Wafer Bonding for 3D Interconnects
P. Lindner, J.Weixlberger, V. Dragoi, T. Glinsner, C. Schaefer (Austria) |
Bumpless Flip Chip Technology Using Copper Lead and Electroplating Technology
Ch.W. Lin, S. Chiang (Taiwan) |
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Advanced Wire Bonding for High Frequency Devices
S. Stoukatch, H.H. Meng, K. Vaesen, S. Brebels, W. De Raedt, E. Beyne (Belgium) |
Deposition of Gold Film on Alumina Substrate without Seed Layer for Microwave Integrated Circuits
D. Balasubramanyam, O.P. Kaushik (India) |
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Methods for Evaluation of Gravure-Offset Fine-Line Circuitry Printing Inks
M. Pudas, J. Hagberg, S. Leppävuori, K. Elsey, A. Logan (Finland/UK) |
Microwave/mm-Wave Applications: a New Challenge for Ceramic Thick Film Technology
J. Cocker, G. Vanrietvelde, E. Polzer, S. Nicotra, J. Müller, A. Brokmeier (UK/France/Germany/Italy) |
| 1320 - 1500 |
Lunch
Parallel Sessions
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| 1500 - 1620 |
Session 3:
Environmentally-Friendly Electronics
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Session 4:
Diagnostics, Quality and Reliability (Part I)
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Lead Free Solder Pastes for Printed and Hybrid Circuits Soldering
K. Bukat, D. Rocak, J. Sitek, J. Fajfar-Plut, D. Belavic (Poland/Slovenia) |
Sensors for Products Reliability Monitoring
M. Pecht (USA) |
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Wetting Balance Evaluations of the Solderability of Lead-Free Solders
S.M. Adams, Ch. Hunt (USA/UK) |
Dimensional Control of High Density Interconnect (HDI) Packaging by Means of Confocal Measurement Technique
R. Brodmann, R. Liebe, F. Gilbert, P. Kracik (Germany) |
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Impact of Environmental Regulations on Electronics Manufacture, Use, and Disposal
Ji Wu, R. Ciocci, M. Pecht, A. Picard (USA) |
Electric Force Microscopy Investigation of the Microstructure of Thick Film Resistors
A. Alessandrini, G. Valdre, B. Morten, M. Prudenziati (Italy) |
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Study on Green Product Reliability for BT Substrate Base CSP (Chip Scale Package)
C.L. Chung, C. S. His, S.L. Fu, S. Chou, S. Lin, R.B. Tsai, M.L. Huang, P. Ku (Taiwan) |
Thermal Characterisation of Packages by Inverse Heating
G. De Mey, P. Kawka (Belgium) |
| 1620 - 1650 |
Coffee Break
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| 1650 - 1830 |
Session 5:
Assembly Technologies
(Part I)
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Session 6:
Diagnostics, Quality and Reliability (Part II)
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The Influence of Overheating, Flux and Solder Type on Wettability of Lead-free Solders
R. Kisiel (Poland) |
Parameter Study for the Reliability of Underfilled Flip Chip and CSP Assemblies
B. Vandevelde, D. Degryse, E. Beyne (Belgium) |
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Solder Joint Study by Scanning Acoustic Microscopy (SAM) for RF Power Amplifier Carrier
F. Weng, P. Ronkainen, P. Pajala, P. Valiamaki (Finland) |
In-Process Verification of MLC Substrates
J. Müller, J. Klein, J. Rayho, K. DiGravio, J. Paumi (Germany/USA) |
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A Measurement Technique for Stencil Printed or Dispensed Solder Paste
M. Dušek, Ch. Hunt (UK) |
Technological Evaluation and Reliability of UV Laser Microvia
H. Hackiewicz, G. Koziol, E. Malczynska-Paz (Poland) |
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Evaluation of Soldering Properties of Silver Conductor Pads on LTCC Structures Using Selected Lead-free Solders
A. Bochenek, B. Bober (Poland) |
Microelectronics Assembly Innovations, Based on Capillary Connection (C2) for Assembly Fabs
A. Taran, V. Krivoshapko (Russia) |
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Reliability of Solder Joints in LTCC/PCB Assemblies
R. Rautioaho, O. Nousiainen, S. Leppävuori, J. Vahakangas |
| 1930 - 2400 |
Gala Dinner
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TUESDAY, 18th June 2002
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Plenary Session II
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| 900 - 940 |
Invited paper 3:
Trends in Wireless/RF/Optoelectronic Integrated Packaging
Greg Caswell (USA)
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| 940 - 1000 |
Invited paper 4:
Electrical Properties of Adhesive Joints
Jan Felba (Poland)
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Parallel Sessions
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| 1005 - 1145 |
Session 7:
Assembly Technologies
(Part II)
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Session 8:
Passive Components, Sensors, MEMS (Part I)
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Rheological Characterization and Multi-Scale Computational Simulations of Electrically Conductive Adhesive Flows
G.P. Glinski, C. Bailey, R. Durairaj, N.N. Ekere (UK) |
Laser Treatment of LTCC for 3D Structures and Elements
J. Kita, A. Dziedzic, L.J. Golonka, T. Zawada (Poland) |
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Solder Alternatives: Conductive Adhesives with Stable Contact Resistance and Improved Mechanical Performance
G. Dreezen, G.Luyckx (Belgium) |
Using LTCC for Microsystems
T. Theleman, H. Thust, M. Hintz (Germany) |
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PC 3000 - The New Generation of Isotropic Conductive Adhesives
H.-W. Hagedorn, J. Neumann-Rodekirch (Germany) |
On the Zero Offset Stability of Thick Film Strain Gauges
J. Atkinson, Y. Zheng, R. Sion (UK) |
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High Density Flip Chip with Adhesives on Ceramics
B. Vandecasteele, T. Podprocky, J. Vanflateren (Belgium) |
Design Optimization of an Eddy Current Sensor Using the Finite-Elements Method
J. Wilde, Y. Lai (Germany) |
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Recent Developments in Anisotropic Conductive Films for Flip Chip Interconnection Based on Z-axis Conductors
A. Gasse, J.-Ch. Souriau, C. Rossat, P. Renard, G. Poupon (France) |
Effect of g-Radiation onto the Properties of TeO2Thin Films
K. Arshak, O. Kostrynska (Ireland) |
| 1145 - 1315 |
Poster Session + Exhibition + Coffee Break
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| 1315 - 1430 |
Lunch
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Parallel Sessions
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| 1430 - 1610 |
Session 9:
Packaging and Interconnection
(Part II)
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Session 10:
Passive Components, Sensors, MEMS
(Part II)
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Ultra Thin IC Package
E. Janssen, K. Slob, J. van Delft, R. Vranken, Co van Veen (The Netherlands) |
Low Temperature Co-Fired Ceramic Packages for High Frequency and Digital Applications
L. Chai, A. Shaikh, V. Stygar (USA) |
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A Ceramic BGA148 Package for Assembly of a 2 Gsps Analog to Digital Converter
B. Dervaux, F. Bore, O. Gaillard (France) |
High Density Packaging Technology for Pressure Sensor Applications
M. Pavlin, D. Belavic, M. Santo Zarnik, M. Hrovat (Slovenia) |
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The Influence of Packaging Materials on RF Performance
A. Chandrasekhar, S. Brebels, S. Stoukatch, E. Beyne, W. De Raedt, B. Nauwelaers (Belgium) |
Fodel Microresistors - Processing and Basic Electrical Properties
A. Dziedzic, L. Rebenklau, L.J. Golonka, K.-J. Wolter (Poland/ Germany) |
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Taiwan Packaging Status
S.-L. Fu, S.H. Huang, E. Wu (Taiwan) |
RF On-Chip Passive Components Fabricated by CMOS Compatible Cu Interconnect Technology
G. Lihui, Y. Mingbin, Ch. Zhen, Z. Yi, N. Loke, L. Chaoyong, Y. Bo (Singapore) |
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The Packaging of ICs: A New Approach
V.I. Rudakov (Russia) |
Spiral Inductors in Multi-Layer Thin-Film MCM-D
G. Carchon, S. Brebels, K. Vaesen, W. De Raedt, E. Beyne (Belgium) |
| 1610 - 1750 |
Session 11:
Applications
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Session 12:
Design, Modelling and Simulation
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2002 High Density Microelectronics Roadmap for Space Applications
L. Galbraith (USA) |
Multiobjective Optimal Design of Printed Wiring Boards with Forced Air Cooling
Q. Li, O.A. Palusinski (USA) |
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Understanding the "Immunity Level" and "EM Compatibility" of Electronic Packaging with Embedded EMI Shielding
S. Oggioni, M. Spreafico (Italy) |
Effects of Misalignment on Reliability of Flip-Chip Solder Joints by FEM
J. Valtanen, P. Heino, E. Ristolainen (Finland) |
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Thermal Optimization of Miniaturized Camera and Pentium PC Module
Z. Stossel, F. Vogel, R. Kothe (Switzerland) |
Future Design Concept for Motorola Smart Connector
A. Schaller, A. Kolbeck, H. Wieser, T. Hauck, M. Riess (Germany) |
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Realisation of Narrow Conductor Lines in LTCC Modules by Etching Technique
M. Lahti (Finland) |
Investigation of Coplanar Ground Inductor Design and Performance on Laminates
S.L. Cheah, M. Rotaru (Singapore) |
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A Radio Listener Research System in a Wristwatch
A. Kieser (Switzerland) |
Numerical Stable Green's Function Approach for Admittance Components Calculation of Multiple Coupled On-Chip Interconnects
H. Ymeri, B. Nauwelaers, K. Maex, S. Vandenberghe, D. de Roest (Belgium) |
| 1750 |
Closing Ceremony
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