IMAPS 2002 Technical Sessions
Greetings from Colorado!
I would like to take this opportunity to tell you about the technical conference at IMAPS 2002. Abstracts have been streaming in from all over the world. We now have nearly 250 abstracts to choose from in what is shaping up as one of the strongest technical programs in recent years. Add to that a full line up of Professional Development Courses and you have the makings of the 35th International Symposium on Microelectronics in Denver, CO. IMAPS continues to provide critical information to increase one’s knowledge and understanding of the ever-changing world of microelectronics.
Year after year, IMAPS delivers unmatched quality of papers and presentations on new and emerging technologies from leading industry professionals. This yearís conference has a strong line-up of papers focusing on the more traditional topics such as thick film and thin film hybrid applications and surface mount, but we also have the new and emerging areas covered such as lead-free soldering, precision opto-electronic assembly and packaging, the state-of-the-art in MEMS technologies, wireless applications, high density interconnection, integrated passives and much, much more.
So, come and join us at the technical conference and exhibition in Denver. Weíve got a gold mine of information for you to sharpen your skills. Along with the exceptional technical program, take advantage of the networking opportunities and spend some quality time with your peers. You never know when you might score with that one tidbit of information that you can only get by attending. We look forward to seeing you here in September!
Best regards,
Rick Charbonneau, StorageTek
Technical Program Chair
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