Around the Microcircuit
Chicago-Milwaukee Chapter – Our chapter is working on ways to increase meeting attendance and entice more members to get involved in the chapter. Richard Breck (our chapter national IMAPS contact) and I plan to visit major companies dealing in microelectronics in order to obtain support to send their people to our meetings. We are also assigning people in these companies to spread the word about IMAPS and its benefits. We have also asked suppliers who do business in microelectronics to encourage new members and inactive members to come to our meeting, possibly paying the meal cost of first timers to our meetings. We had 22 members attend our last meeting on Feb.19, which was a decent showing. E. Ralph Egloff gave a paper on “Enhancing Your Circuits with Polymer Thick Film.” The presentation was well received. There were several new faces at that meeting which was a good sign, including two new student chapter members. We polled the attendees at the meeting and almost all of them thought they would attend our next meeting on March 26.
Upcoming meeting topics are:
March 26 - The Mechanism and Prevention of Conductor Fracture on Printed Multilayer Ceramic and LTCC Substrates, by Jiming Zhou of Delphi Automotive Systems.
April 24 - An all day symposium with sessions on: Screen Printing, Wire Bonding and Reliability, Hermetic Packaging, Flip Chip, and Chip Scale Packaging.
Northwest Chapter – The chapter’s April 18th meeting was hosted by Intel in Hillsboro, Oregon, and was a great success. The chapter is deeply indebted to Philip Chen as the session chair, to Intel for generously hosting the meeting, and to our sponsors for providing financial support for this event.
The chapter’s next meeting is scheduled for Wednesday, July 17 in the Seattle area. The host and topics for the technical session have not been finalized as we go to press; contact John Lee (johnlee@zmation.com) if you have a paper you wish to present at this or a future meeting.
Attendance at the chapter meetings has been steadily increasing and we expect 50-60 attendees at each meeting. To become a chapter sponsor or receive the chapter’s newsletter (circulation 400+) with details of upcoming meetings, contact Wes Saulsberry (Charles.w.saulsberry@boeing.com) or Ernie Vasvary (vasvarye@biotronik.com). More information about the chapter is also available at the chapter webpage at http://www.imaps.org/chapters/northwest.htm.
SoCal’02 Invites You to the 22nd Annual IMAPS
Southern California Chapter Symposium and Exposition!
We have enjoyed the excitement of networking via this local symposium for twenty-one years. Now, your 22nd IMAPS SoCal ‘02 Symposium and Exhibition has returned to the Pasadena Convention for 2002, and we are all excited about getting together again. This year the ANGEL (Los Angeles) Chapter has the honor of hosting. Don’t miss your opportunity to see leading edge products from more than 60 exhibitors and hear the latest technical presentations from our select group of speakers. Each speaker is an industry expert who will provide in-depth knowledge of timely topics. As examples of this, you will note that we selected topics dedicated to Advanced Microelectronics Materials and Processes, CS Packaging, Components Technology for the future, Surface Mount Technology, Emerging Optoelectronic Packaging, High Density Packaging and LTCC. At the same time, we selected topics in Ceramic Packaging, Assembly, and Components to heighten your interest level with interrelated technologies and to possibly offer new insights in your thinking.
The exhibit area (which will also serve as the lunch area) is strategically arranged to maximize dialogue with industry professionals and will provide you the opportunity of additional networking. All of our exhibitors are in technologies that are interrelated and focused toward the common goal of electronics packaging. We selected the Pasadena Convention Center not only for its centralized location in Southern California, but also for its spacious accommodations and convenient adjacent locations for registration, technical sessions and exhibits. This unique forum assures that you, the individual, isn’t lost in the crowd. Our primary focus is toward the practical – current aspects of business, manufacturing, production equipment and materials.
For more information and to register for attendance or to exhibit, please go to: http://www.imaps.org/chapters/socal02.htm
Michigan Chapter – Kick-Off Meeting, March 6, 2002 - Michigan’s newly formed IMAPS chapter held its first meeting on March 6, 2002, at Richards Family Restaurant in Livonia, Michigan. Larry Rexing, IMAPS, North Central Regional Director opened the meeting, welcoming the attendees and explaining the charter of the IMAPS organization.
Special guests included: Steve Capp, IMAPS National Treasurer; Anitha Sinkfield, President Indiana Chapter; Neil Thomas, V.P. Indiana Chapter; and Bill Kidder, Treasurer Chicago/Milwaukee Chapter.
Officers for the new Michigan chapter are:
President, John McConnell, Lear Corporation
Vice President, Adam Schubring, Visteon
Secretary, Ray Sire, Continental Teves
Treasurer, Jack Ko, Picometrics
Program Chairman, Mike Head, Semisource
Guest Speakers included: Matthew Walsh, Delphi Automotive Sys.; Theresa Sims, Heraeus Inc.; and Ray Fairchild, Delphi Automotive Systems. Each provided a brief discussion of their papers presented at the SAE Conference.
Plans are being made for a follow up meeting in May.
| Table
of Contents | Previous
Page | Next
Page |
