IMAPS Announces “Ceramic Interconnect Technology: The Next Generation” 2003 Conference
IMAPS and the Ceramic Interconnect Initiative (CII) will bring enabling ceramic interconnect technology to the forefront with the “Ceramic Interconnect Technology: The Next Generation” conference, scheduled for April 8-9, 2003, at the Westin Hotel in Denver, Colorado, USA.
Sponsored by IMAPS and the Ceramic Interconnect Initiative, and endorsed by the American Ceramic Society, this expanded 2003 Conference on Ceramic Interconnect Technology will explore leading-edge issues in ceramic interconnect technology, which has a long history of meeting the requirements of the most demanding applications.
The organizing chairs have selected a world-wide panel of industry experts to chair sessions for this conference. They and their planned sessions include the following:
Design, Simulation & Modeling
John Gipprich
Northrop Grumman
Power and Thermal Management
Dr. Kinzy Jones
Florida International University
Portable Wireless & Bluetooth
Dr. Fred Barlow
University of Arkansas
Broadband
Dr. Jens Mueller
University of Erlangen
Fiber Optic and Electro-optic
Dr. Alan Lyons
Lucent Corp.
LTCC
Dr. Mike Lanagan
Penn State University
Materials
Dan Amey
DuPont Electronic Technologies
Automotive
Dr. D H Sarma
Delphi Automotive
Integrated Passives
Dr. William Borland
DuPont Electronic Technologies
Testing and Measurement
Mike Janizec
NIST
Assembly
Paul Collander
NOKIA
Base Station
George Passiopoulos
NOKIA
Military
John Roman
Consultant
Novel Applications
Steve Dai
Motorola
Ceramic Interconnect Markets
Rick Sigliano
Kyocera Americas
In addition, keynote speakers are expected to review technology and applications in areas of high interest, including embedded passives, automotive, microfluidics and MEMs.
The growth of wireless communication to its current pervasive position in both developed and developing nations, extending from microwave to millimeter wave, continues to create a host of opportunities for which ceramic technology is enabling. At the same time, the demand for bandwidth driven by the Internet and data communications has sparked an increased need for optical communication equipment. For many new interconnect and packaging applications for performance at 40 Gb/sec and beyond, ceramic is again uniquely suited.
Automotive under-the-hood applications for engine control safety applications continue to drive the growth of ceramic in automotive applications. Conventional ceramic technologies such as thick film, thin film, plated copper and high temperature co-fired ceramic are being revolutionized and extended, and are being adopted for leading edge applications in wireless and optical communications, automotive, MEMs, Sensors, and energy.
General Chair for the conference is Dr. Samuel J. Horowitz, DuPont Electronic and Communications Technology; Technical Chairs for the event are Mike Ehlert, National Semiconductor, and Dr. Duane Dimos, Sandia National Laboratory.
Papers are invited for the conference; persons wishing to present papers are invited to submit a 250-300 word abstract electronically by November 15, 2002, using the on-line form at www.imaps.org/abstracts.htm. Anyone having difficulties with the on-line submittal form should e-mail Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433. The CII is a group of industry professionals dedicated to bringing information on the use and benefits of ceramic interconnect technology to OEM engineers and designers.
