European Microelectronics
Technologies - again
It is with great satisfaction that I see the diversity of technologies being introduced and utilised. One example is the flip chip bumping and flip chip joining technologies. Not only in the Far East do we see that flip chip bumping and joining can be more than the C4 technology. In Europe many applications using gold stud bumping in combination with ICA (isotropic conductive adhesive) and capillary flow underfill, or gold stud bumping with NCP (non conductive pastes), are in production. Also applications with low cost electroless nickel gold bumping with ICA, ACF or NCP, or meniscus-coated solder bumps with NCP or electroplated gold bumps with ACF are seen.
Subcontractors for the various bumping needs are popping up - for the electroless Nickel Gold or for gold stud bumping - and we see a range of applications getting started with flip chips. Not only the companies who “have to,” like the hearing aid manufacturers due to the miniaturisation needs for the CIC (completely in the channel) devices, but automotive, industrial and now also communication applications are seen.
Companies involved with or using MEMS sensors, will find themselves facing flip chip(-like) needs due to the miniaturisation involved, and soon we might see mobile phone applications having tiny wafer level packaged IPDs (Integrated Passive Devices) or MEMS-based microphones. Many of these applications will probably start with modules using the wafer level/flip chip components - just as we have seen in Bluetooth modules, but soon we might see FCOB, flip chip on board, for high volume applications.
It might be an easier introduction today - than thought of before - because the OEMs still having in-house production already have been forced to invest in automatic dispensers and underfill curing systems for their CSP underfilling, and we might eventually see that not all flip chip assembly will end up at the EMSs (Electronic Manufacturing Services) located in the Far East. Till now most of the module production has taken place at EMSs but it must be assumed that significant flip chip volumes could be seen with the European OEMs.
Automotive volumes are still at a very high level and the flip chip needs also here are increasing due to increased number of sensors and the needs for miniaturisation of controls and actuators.
Which technology to choose?
As always it depends of your needs - cost, reliability, volume, infrastructure - so therefore you have to know the possibilities and limitations in all the various options before you make your choice.
Here IMAPS can meet your demands being an open-minded, non-biased society offering the learning possibilities at the many conferences held worldwide. The European IMAPS events are known to be broad and still focused - so please already now plan to meet us in Friedrichshafen next year in June at the European IMAPS conference and exhibition!
Søren Nørlyng
noerlyng@micronsult.dk
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