3M Packs a Punch
3M has announced a unique wafer transport system offering enhanced protection and significant cost savings. The 3MÔ Wafer Transport System integrates consultation, premium packaging components and technology, financing options, inventory management, Six Sigma quality, global support and 3M transport packing experience.
Semiconductor manufacturers can turn to 3M’s new System for packaging materials and protection of delicate wafers, to provide and replenish packing materials, and to manage the logistics.
For more information, please call 651-736-0111.
Economical, Manual Lead Form & Trim Systems from FANCORT
Fancort Industries has introduced manual lead form and trim equipment for molded semiconductor packages on lead frames. This equipment is for managers with tight budgets, short production runs, and new package development. The tooling for this equipment can be designed for any type of package, including fine pitch devices with high lead counts.
For more information, please call 973-757-0610.
New Catalog Highlighting Stencil Options from MICROSCREEN
MicroScreen has developed a new quick catalog highlighting stencil options to minimize assembly downtime and improve solder paste printing on surface mount PC boards. The catalog gives an overview of a new low-elongation metal with a fine-grain structure, robust fiducials and high-temperature adhesive for newer cleaning chemistries and AOI verification of stencils for absence/presence, blockage and size.
For a copy of the catalog, please call 574-232-4637.
MORGAN ADVANCED CERAMICS Presents DiamonexÆ CVD Diamond Heat Spreaders
Morgan Advanced Ceramics, a world-leading supplier of innovative ceramic solutions for the medical, telecommunications, semiconductor and aerospace markets, introduces its DiamonexÆ CVD Diamond heat spreaders. Diamonex heat spreaders are ideal for high power device applications, such as laser diodes, microwave FETs and MMICs, and advanced multi-chip modules (MCMs).
For more information, please call +44 1299 872210.
PARELEC Announces New Flexible Substrate Solutions
Parelec, Inc. has introduced the ModflexÔ polymide films, the first in a family of new specially developed, flexible substrates used to print solderable silver circuitry. ModflexÔ polymide films work in conjunction with Parmod VLT to offer the electronic industry’s first fully additive process for screen printing circuits and reflow soldering components.
For more information, please call 609-279-0072.
SHIPLEY’s New Thick Film Liquid Photo Resist for Bump Imaging Applications
Shipley Company’s Electronic and Industrial Finishing has announced the commercialization of a new thick film plating resist for wafer bump imaging applications available under the product name Shipley. The BPR™ -100 has the ability to apply 70 to 100 micron thick resist in a single-spin cycle that eliminates the need for mushroom plating and produces a more controlled bump footprint for reduced pitch designs in high density applications. The resist features a nominal 1:1 resolution with standard coating, imaging and developing tools.
For more information, please call 1-800-645-2996, ext. 262.
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