Medical Packaging

On the cover: Novel, new medical applications for electronics packaging. The cover was designed by Jacob Elbaz of The Johns Hopkins University Applied Physics Laboratory.

• Guest Editorial: Ceramics - Medical Packaging
  John Balde, InterConnection Decision Consulting

• Electronic Instrument Development for Applications in Space Biomedicine and Astronaut Health
  Harry K. Charles, Jr., Ph.D.

• Insulating Barrier Coatings for Flexible Ribbon Cables and Microelectrodes Suitable for Implantable Devices
  Helmut Eckhardt, Jerome J. Cuomo, C. Richard Guarnieri, Vinay Sakhrani, H. Troy Nagle and Stefan Ufer, Premitec, Inc.

• Bob Osman Retires
  

• Best Papers of IMAPS 2002

• Top 10 Developments in Ceramic Interconnect Technology

• Call for Award Nominations

• Ceramic Interconnect Technology: The Next Generation 2003 Conference
  

• Changes at Headquarters

• European Activities & Calendar of Events