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IMAPS Announces 2002 Society Awards Recipients
The International Microelectronics And Packaging Society (IMAPS) is pleased to announce the recipients of its 2002 Society Awards. The Society annually recognizes achievement and dedication by both individual members and member companies through these prestigious awards. The Awards Ceremony took place on Wednesday, September 4, 2002, in the IMAPS Exhibit Hall at the Colorado Convention Center, Denver, Colorado.
The Daniel C. Hughes, Jr. Memorial Award was awarded to Rao R. Tummala, Ph.D., for his dedication to IMAPS and the microelectronics industry. Dr. Tummala is being honored for his significant technical contributions to IMAPS in the fields of Materials and Processes for Advanced Ceramic Packaging, Flip Chip Technology and Integrated Passives; commitment to the development of students in the industry; and commitment to the Society in the capacity of President, Technical Vice President, and International Vice President, advancing both the Technical Scope and the Membership Programs of the Society.
The Daniel C. Hughes, Jr. Memorial Award is the most prestigious award given by IMAPS. It is presented to the individual who, in the opinion of the Daniel C. Hughes, Jr. Memorial Award Selection Committee, has the greatest combination of technical achievements related to microelectronics, combined with outstanding contributions supporting the microelectronics industry, academic achievement, or support and service to IMAPS. Recipients must be an IMAPS member in good standing for a minimum of five years to qualify for this Award. Recipients of this award automatically become “LIFE MEMBERS and FELLOWS” of the Society.
The William D. Ashman Memorial Award was awarded to Leonard W. Schaper, Ph.D., for his outstanding contributions to the field of Electronic Packaging, particularly advances in board, module, and chip package power distribution and decoupling capacitor design, leading to higher performance system designs.
The William D. Ashman Memorial Award recognizes an individual who, in the opinion of the William D. Ashman Awards Selection Committee, has provided significant technical contributions to the electronics packaging industry, while participating and demonstrating support of activities to enhance the electronics packaging profession as a member. Recipients of this award automatically become “LIFE MEMBERS and FELLOWS” of the Society.
Theodore G. Tessier, Ph.D., was awarded the John A. Wagnon Technical Achievement Award for his outstanding contributions to the advancement of state-of-the-art in Chip Scale Packaging, Wafer Level CSP and High Density Interconnect.
The John A. Wagnon Technical Achievement Award is given to a member of the Society who, in the opinion of the John A. Wagnon Technical Achievement Awards Selection Committee, has made outstanding technical contributions related to microelectronics technology. The award may be given for a specific accomplishment, for a number of accomplishments over a period of years, or for general overall contributions to the microelectronics industry.
Semi Dice, Inc. was the recipient of IMAPS’ Corporate Recognition Award. Semi Dice, Inc. was honored in appreciation of its dedicated service and in recognition of its outstanding contributions to the advancement and success of IMAPS through continued financial support of the Sidney J. Stein Educational Foundation; corporate involvement with the MMRC and involvement with the Known-Good-Die issue that has advanced awareness of Flip Chip Technology in the microelectronics industry.
The Corporate Recognition Award recognizes a corporation (or the appropriate division or department of a corporation) that in the opinion of the Corporate Recognition Awards Selection Committee, has made significant technical contributions to the microelectronics industry, while demonstrating support of IMAPS through participation in such activities as Organizational and Regular Memberships, promoting member participation in IMAPS- sponsored activities, sponsorships, Educational Foundation contributions, and by exhibiting at the Annual Symposium.
Herbert Neuhaus, Ph.D., Kaoru Hashimoto and Stanislaw Nowak were each named Fellow of the Society in recognition of their long-term significant and continuing contributions to IMAPS and the microelectronics and packaging industry.
The Fellow of the Society Award is designed to honor and recognize those who, in the opinion of the Fellow of the Society Awards Selection Committee, have made significant and continuing contributions to IMAPS over the years. A nominee must have been an IMAPS member for ten consecutive years.
Hans O. Danielsson, Ph.D., was presented with the IMAPS International in recognition of long-term continuing technical and organizational work significantly contributing to the International growth of the Society.
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