New 2003 Executive Council Members Bring Experience, Dedication to IMAPS
The International Microelectronics And Packaging Society (IMAPS) announces the slate of Executive Council Members for 2003, including several newly elected members. The new council brings broad experience and dedication to the 2003 Council. The 2003 Executive Council will assume their offices during IMAPS 2002 in Denver, Colorado.
President, Dr. Peter Barnwell, pbarnwell@4cmd.com; Peter Barnwell is Director, Advanced Technologies, for Heraeus Incorporated, Circuit Materials Division, based in Pennsylvania. His long involvement with IMAPS began as a founding member of both the UK chapter and the European Liaison Committee. He served as President of IMAPS Europe (1999-2001) as well as spending several years on the IMAPS UK committee as Chairman (President) and Treasurer. A founding member of the Ceramic Interconnect Initiative (CII), Peter also holds recognition as a Fellow of IMAPS. He received his B.Sc. Applied Physics from City University, London, in 1966 and his Ph.D. in 1973. Her Majesty the Queen appointed him a Member of the Order of the British Empire (MBE) in 1984 for services to industry. Peter’s industrial experience includes the founding and leadership of two hybrid microelectronics companies in the UK and serving as director of two publicly quoted venture capital organizations. In the early 1980s he helped lead development of the surface mount industry in the UK. He also held positions as Professor and Dean at Kingston University, England, and worked with several other universities.
President-Elect, Mr. Phillip J. Zulueta, phillip.j.zulueta@jpl.nasa.gov (Newly Elected); Phil Zulueta has been a member of ISHM/IMAPS since 1979 and is the second-term incumbent Southern California Regional Director of IMAPS. He is also the current IMAPS Technical Sub-Committee Chairman for Photonics/Optoelectronics Packaging, Past-General Chairman for the IMAPS Southern California Regional Symposium, has held various offices and appointed positions at the local chapter level including Past-President of the Orange Chapter of ISHM (International Society for Hybrid Microelectronics). Currently, he manages the Engineering Assurance and Advanced Technology Group at Jet Propulsion Laboratory, Pasadena, CA, where he manages a team of engineers and technologists involved in a variety of disciplines that include: Electronics Packaging Technology, Non-destructive Evaluation, Manufacturing Technology Transfer and Certification, Extreme Cold Temperature Testing, Optical Metrology and Electro-Static Discharge (ESD) Awareness and Control. He is also a JPL Program Element Manager and the Electronics Packaging Project Manager for the NASA-wide Electronic Parts and Packaging Program. That activity involves the evaluation of new and advanced electronics packaging technologies for NASA applications. Prior to joining JPL, he was Western Regional Manager for Electro-Science Laboratories in King of Prussia, PA, Program Manager for Ball Aerospace Microelectronics in Huntington Beach, CA, an Engineering Group Manager for Hughes Microelectronics in Newport Beach, CA, and a Microelectronics Process Engineer for Northrop Electronics in Hawthorne, CA. His education includes a Masters degree in Business Administration from Pepperdine University and a Bachelor of Science degree in Materials Engineering from California State University Long Beach. Phil has also been a past member of SMTA (Surface Mount Technology Association) and SID (Society for Information Display).
First Past President, Dr. Charles E. Bauer, Chuck.Bauer@TechLeadCorp.com; Charles Bauer is President of Tech-Lead Corporation, joined ISHM/IMAPS in 1984, playing an active role ever since. He served as President of the Northwest Chapter, Technical Chair of the 1988 National Symposium, Seattle, WA, and President of the Rocky Mountain Chapter (after moving from Tektronix in Beaverton, OR, to Coors Electronics in Golden, CO). As Technical Vice President of the Society, Chuck established the ISHM/IMAPS Advanced Technology Workshop program to encourage continual technical rejuvenation and opportunity for the society as well as its members. Since leaving the office of Technical VP Chuck has served as General or Technical Chair for eleven different ATWs from the MCM Test ATW in Napa, CA, to the more recent CSP workshops in Whistler, Canada, and Austin, TX. Chuck founded TechLead Corporation in 1991 and was named Fellow of the Society in 1994. He remains active in the Rocky Mountain chapter and has organized the annual High Density Packaging & Interconnection joint meeting with the local SMTA chapter each winter for the past five years. Dr. Bauer frequently presents technical and business-oriented papers and lectures in the areas of electronics packaging, interconnection and assembly, predictive engineering and design for manufacture as well as international marketing in Europe, Asia Pacific, and South America in addition to North America. He also served two terms on the Board of the SMTA and in 1995 founded the Pan Pacific Microelectronics Symposium, a joint effort between IMAPS, SMTA and SEMI.
Treasurer, Mr. Steve Capp, stevec@laserage.com; Steve Capp is currently President and CEO of Laserage Technology Corporation where he has also held the positions of Plant Manager and Vice President of Operations. He graduated from Milwaukee School of Engineering in 1978 and has been active in the microelectronic industry most of his career, joining IMAPS in 1980. He is currently active in the Chicago Milwau- kee Chapter and has served in several chapter offices including Chapter President. Steve also has served as General Chair of the 1999 International Symposium Committee and currently serves as a member of IMAPS’ Sidney J. Stein Educational Foundation.
Vice President of Information, Dr. Aicha Elshabini, aicha@engr.uark.edu (Newly Elected); Aicha Elshabini is Pro- fessor of Electrical and Computer Engineering. She ob-tained a B.Sc. in Electrical Engineering at Cairo University, 1973, in both Electronics and Communications (five year program), a Masters in Electrical Engineering at University of Toledo, 1975, in Microelectronics, and a Ph.D. in Electrical Engineering at the University of Colorado, 1978, in Semiconductor Devices and Microelectronics. She served at Virginia Tech Institution for the period 79-99, assuming the position of Director of the Microelectronics Laboratories. She has also served at the capacity of Chair for the Electronics/Circuits Area at the Bradley Department of Electrical and Computer Engineering (for twelve years). During her career, she has worked on the board of many industrial companies, and volunteered work with the United Nations. Currently, she is Professor and Department Head for the Electrical Engineering Department at University of Arkansas (since July 1, 1999), and Interim Department Head for the Computer Science & Computer Engineering Department (since July 1, 2000). She has been serving as the faculty advisor for IMAPS’ student chapter at both institutions since 1980 to present time. Dr. Elshabini is a Fellow member of IEEE/CPMT Society (1993) Citation for ‘Contribution to The Hybrid Microelectronics Education and to Hybrid Microelectronics to Microwave Applications,’ a Fellow member of IMAPS Society (1993), The International Microelectronics And Packaging Society, Citation for ‘Continuous Contribution to Microelectronics and Microelectronics Industries for numerous years.’ Dr. Elshabini was awarded the 1996 John A. Wagnon Technical Achievement Award from IMAPS. She has served as the Editor of the IMAPS International Journal of Microcircuits & Electronic Packaging for 10 years.
Vice President of Technology, Dr. R. Wayne Johnson, Johnson@eng.auburn .edu (Newly Elected); R. Wayne Johnson, Ph.D., is an Alumni Professor of Elec- trical and Computer Engineering and Dir-ector of the NSF Center for Advanced Vehicle Electronics at Auburn University. He has established teaching and re-search laboratories at Auburn for advanced packaging and electronics assembly. Research efforts are focused on materials and processing for electronics assembly with emphasis on harsh environments. He has published and presented numerous papers at workshops and conferences and in technical journals. He has also co-edited a book on MCM technology and written four book chapters in the areas of silicon MCM technology, MCM assembly, hybrid technology and high temperature packaging. A member of IMAPS for 23 years, Wayne was the 1991 President of IMAPS. He received the 1993 John A. Wagnon Technical Achievement Award, was named a Fellow of the Society in 1994 and received the Daniel C. Hughes, Jr. Memorial Award in 1997. He is also a member of IEEE, SMTA, and IPC. He received the B.E. and M.Sc. degrees in 1979 and 1982 from Vanderbilt University and the Ph.D. degree in 1987 from Auburn University. He has worked in the microelectronics industry for DuPont, Eaton, and Amperex.
Secretary, Mr. Lawrence J. Rexing, lrexing@4cmd.com (Newly Elected); Larry Rexing has been a member of ISHM/IMAPS for over 15 years. He has 30 years of experience in the thick film and packaging industry. Larry is currently employed by Heraeus Incorporated, Circuit Materials Division, as Midwest Regional Sales Manager, a position he has held for over four years. He has a BSEE degree from Purdue University. Larry has held many leadership positions with the Indiana chapter, including Chapter President. Larry has been a member of the Executive Council and held the position of North Central Regional Director for four years. He has co-authored and presented several papers at the regional and local levels. He also helped organize and initiate the first MCM Test workshop in Napa Valley.
Organizational Director, Mr. Richard E. Sigliano, rsigliano@zecal.com; Mr. Sig-liano has 26 years of experience in the hybrid microelectronics and semiconductor packaging industry. During the past 15 years, Rick has been involved in the IMAPS Technical area serving four years as chapter President (2 years), Program Technical and Sponsor Chairs. Rick has supported technical events contributing with papers at both the local chapter and national levels. In addition Rick has served as Program Chair for the SoCal symposium. On the national level, Rick currently chairs the Thin and Thick Film Subcommittee as part of the National Program Technical Committee and holds the General Chair of the High Speed Digital ATW. Past responsibilities include: Program Chair for the Int’l MCM Conference and Session Chair for numerous symposia, conferences and ATWs. He also served on the committee for the Los Angeles symposium in 1995 and the San Diego symposium in 1998.
Northeast Regional Director, Ms. Susan C. Trulli, strulli@astex .mksinst.com (Newly Elected); Susan Trulli is currently a Senior Scientist at MKS Astex Products Group in Wilmington, MA. There she is working on power hybrids and thermal transfer issues for power supplies used for plasma generation in semiconductor processing. She has over 23 years of experience in hybrid microelectronics and has specialized in microwave microelectronics for commercial, space and military applications from initial design through transition to production. Prior to working at MKS, Susan spent many years at Raytheon where she received the Thomas K. Phillips Award for Excellence in Technology and the Raytheon Microelectronics Distinguished Contribution Award, both in 1996 and the Advanced Manufacturing Engineering Council, “Excellence through Performance” Award in 1988. Susan joined ISHM in 1984 and has been active in her regional New England chapter. She was elected Secretary to the New England IMAPS Executive Board in 1998 and as served as the Microwave Technology Session Chair for the NE IMAPS Symposium from 1999 to present. She has also been an invited session chair and speaker for several Ceramic Initiative Advanced Technology workshops. Susan has presented numerous papers on microwave module design and materials and holds patents and trade secrets in this area. Susan received her Baccalaureate from Brown University in Physics.
North Central Regional Director, Mr. Gino P. Domenella, ginod@cirqon.com (Newly Elected); Mr. Domenella is a seasoned veteran of the thick film industry, and IMAPS member with over 22 years of service at various leading manufacturers of thick film products in the Chicago/Milwaukee region. Currently, he is an Application Engineering Manager for CirQon Technologies Corporation, the leader in plated and bonded copper-on-ceramic (PBC) hybrid microelectronics circuitry. Areas of focus have included Production Engineering, Process Engineering, Materials, Design, Manufacturing, Management and Operations. He has been involved with ISHM since college when it had a small but recognized presence in the Chicago/Milwaukee area. He was the student chapter President and Treasurer of the student section at Northern Illinois University. Upon graduation, Gino continued to assist the university in the operation and renovation of the thick film lab located on campus and provided and procured thick film materials for use in the lab for student projects. He also mentored several students along the way, who have successful careers within the industry. Gino assisted in the organization of the chapter’s April Technical conference at Northern Illinois University for four consecutive years. Within the Chicago/ Milwaukee chapter he has held the offices of President, Vice President, Treasurer (multiple terms), Assistant Treasurer, Symposium Registration Chair, Nominations Chair and currently holds the Membership Chair position for the past several terms. On a National level, he has been a prior candidate for Regional Director, has assisted at numerous national and local meetings and has chaired sessions at the national meeting in Chicago in 1999. Currently, as Chapter Membership Officer, Gino works closely with national to secure local chapter membership and keep member status current as well as assist members of the IMAPS society. He was recently nominated for Fellow of the Society Award by the Chicago/Milwaukee Chapter.
Mid-Atlantic Regional Director, Dr. Bruce Romenesko, bruce.romenesko@jhuapl.edu; Bruce Romenesko is currently a Principal Staff Physicist in the Electronic Services group of The Johns Hopkins University, Applied Physics Laboratory. He is primarily responsible for technology development within the microelectronics arena. Additionally, he is responsible for packaging and failure analysis of high reliability electronics, including hybrid microcircuits, solder/surface mounted devices, and board level assemblies. He has previously supervised the assembly, process development and substrate fabrication sections within microelectronics at JHU/APL. His packaging experience also includes a role as principal packaging engineer for the signal processor box of the Topex spacecraft. He has recently been active in experimentation in microwave hybrid circuit reliability, in radiation testing of electronics used in spacecraft programs, in area array packaging technologies, and in reliability testing methods. A prime recent role has been that of advisor on electronics materials, packaging and reliability to various Navy programs. He holds a BS in Mathematics and Physics from the University of Wisconsin, and a Ph.D. in solid state physics from the University of Maryland. He joined the JHU/APL Microelectronics group in 1979. Dr. Romenesko has published over 40 papers within physics and microelectronics. He is a member of IEEE and IMAPS, and serves IMAPS on the National Technical Committee’s core committee, as chair of the NTC’s Interconnections subcommittee, as associate editor of the International Journal of Microelectronics and Packaging, and as the Mid-Atlantic Regional Director. He is also a member of the publications committee, and was Technical Chair for IMAPS 2001 symposium in Baltimore.
Southeast Regional Director, Mr. Mike Newton, mnewton@harris.com; Mike Newton is manager of the MicroSystems Technology group at Harris Corporation. He has twenty-four years experience in process development, design in advanced micro- electronic packaging and strategic technologies. His recent emphasis is in sensor technology, ad--vanced dielectrics and MEMS fluidic cooling. Mike has received ten patents and currently has six additional patents submitted. The Charter of the Microsystems Technology Group includes investigating emerging technologies, electronic materials development, and University/National Lab/small business alliances.
Southwest Regional Director, Mr. Frederick R. Hyatt, fred@thusa.com; Frederick R. Hyatt has been active in IMAPS since he began his work with Tong Hsing Electron- ic Industries, Ltd., 14 years ago. He has participated in both the Tucson and Phoenix Chapters and has been involved with several conferences and society sponsored events. He has served as President of the Phoenix Chapter. Professionally, he has worked in several capacities for AT&T International, Caterpillar Tractor Co., and consulted with EPH Engineering Associates. This breadth of experience is built on a strong educational foundation as he holds a Bachelor of Science degree from Brigham Young University and a Master of Business Management degree from Northwestern University. Currently, he is Manager of Business Development for North America at Tong Hsing Electronic Industries, Ltd. and is responsible for the operations of its U.S. office.
Northwest Regional Director, Mr. Anwar A. Mohammed, anwar.mohamed@ultrarf .com; Anwar Mohammed graduated in 1977 with a B.Sc. in Chemical Engineering from Indiana Institute of Technology in Fort Wayne, Indiana, and obtained his MBA from St. Edward’s University in Austin, Texas in 1983. Anwar has been involved with the microelectronics industry since 1977 when he joined CTS in Berne, Indiana, as a R& D Engineer, fresh out of college. He has worked in different roles in many different companies like CTS, Zenith, National Semiconductor, Micro Module Systems, Spectrian and now he is a Senior Manager at Ultra RF, a state of the art wireless company dealing with Si and SiC wireless devices. Ultra RF is a division of Cree Inc. Anwar has authored and presented many papers in the microelectronics field, a good number of them under the aegis of IMAPS. He has also co-authored several patents in the microelectronic industry. He has been a member of IMAPS since 1978 working with the Indiana Chapter, during his employment with CTS. He was also the General Vice Chair for IMAPS during the International Silver Jubilee Symposium and Conference in San Francisco in 1992.
South Central Regional Director, Dr. Ajay P. Malshe, apm2@engr.uark.edu (Newly Elected); Dr. Ajay P. Malshe, is Associate Professor at the Department of Me-chanical Engineering and an adjunct faculty at the High Density Electronics Center (HiDEC), Department of Electrical Engineering, University of Arkansas. His three distinct fields of research and educational interest are integration and advanced packaging of micro and nanosystems, surface engineering of materials for advanced manufacturing, and human-machine interfaces. He has edited two proceedings, and authored one book chapter, over one hundred refereed publications and holds four patents. He is currently an active member of the International Microelectronics And Packaging Society (IMAPS) through the organization of Advanced Technology Workshops (ATW) on MEMS Packaging. Currently, he is the Chairman of the Thermal Management Technical Sub-committee and also, National Chair of Topical Technology Workshops for IMAPS.
Southern California Regional Director, Mr. David C. Virissimo, dvtech@flash.net (Newly Elected); David Virissimo is owner and president of DV Technical Sales, a successful manufacturers’ representative firm serving the electronics industry, since 1995. David received his BS in computer science from U.C. San Diego in 1984. David has been an active member of the San Diego Chapters of IMAPS, ACerS and IEEE/CPMT and currently holds the positions of co-membership chair and circulation chair. David served two terms as Chapter President (1998 & 1999) and two terms as Program Chair (1996 & 1997) as well as Chapter Treasurer. David started initial work to form the UCSD Student Chapter, established in 2000. He was General Chair for SoCal 2000 Regional Symposium. David served as Treasurer & Exhibits Chair for SoCal 1995. He served as Exhibitor Co-Chair for IMAPS’ 1998 National Symposium.
