Guidelines for Editors
Advancing Microelectronics
  1. Editor-in-Chief serves as liaison/coordinator between the Regional Editors and
    Managing Editor of Advancing Microelectronics.

  2. Editor-in-Chief is responsible for completing and adhering to the Editorial Schedule matrix.

  3. Regional Editors are the liaison between the Editor-in-Chief and the authors of the technical articles.

  4. Editor-in-Chief’s responsibilities are for the magazine’s technical content only.

  5. All Editors should submit the following:
    1. Brief “Guest Editorial” describing the theme of the article and goal along with a photo of yourself.
    2. One  Technical article on “hot topics” in the industry, related to the magazine theme.
    3. A color photo, representative of the issue’s theme, for use on the cover of the magazine along with proper acknowledgements.  For example, “Cover photo is the courtesy of____.”  You must also describe the photo for our readers.
    4. The technical pyramid tier under which the submitted article falls.

  6. Technical article submission should:
    1. A current state-of-the-art article not more than one year old.
    2. Be sent via E-Mail to in a Microsoft Word, PC compatible format; or authors can send an PC compatible CD.
      - Be an unformatted document.
      - Not be a PDF file.
      - Not have overly long references or biographies.
    3. Figures, tables and photos, must be sent separately from the original document.
      - Be clearly identified, including descriptions and instructions for placement in the article.
      - Be at least a first or second iteration.

  7. The Managing Editor reserves the right to:
    1. Determine if article is too long for print and forward to Web with appropriate notation in print version of the issue.
    2. Edit each article submitted for grammar, punctuation, and style.
    3. Re-format articles to fit magazine layout.
    4. Remove any overly long references or bios. (We will print “References available upon request” at the end of the article, if this becomes necessary).

*It is important to submit materials on the deadline dates.  Failure to do so results in a delayed publication, which extirpates the timeliness of the information in the issue.

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic
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