Micross

Advancing Microelectronics Editorial Schedule

Issue Theme Copy Deadline Ad Commitment I/Os Deadline

Jan/Feb 2018

Device Packaging Conference, Fan-Out Wafer Level Packaging

Nov. 15, 2017

Nov. 20, 2017

Mar/Apr 2018

RF/Microwave, High-Frequency, High-Reliability

Jan. 15, 2018

Jan. 20, 2018

May/Jun 2018

Heterogeneous Integration - System in Package (SiP)

Mar. 15, 2018

Mar. 20, 2018

Jul/Aug 2018

IMAPS 2018 (Pasadena) Show Issue

May 15, 2018

May 20, 2018

Sep/Oct 2018

Advanced Materials and Additive Manufacturing

July 15, 2018

July 20, 2018

Nov/Dec 2018

Chip Package Interaction (CPI)

Sept. 15, 2018

Sept. 20, 2018

Advertising Opportunities / Media Kit

Contact Ann Bell, Manager, Advertising/Sales
at abell@imaps.org

 

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