KESTER

Advancing Microelectronics Editorial Schedule

Issue Theme Copy Deadline Ad Commitment I/Os Deadline

Jan/Feb 2014

Device Packaging Conference, Wafer Level Packaging, Integrated Passives

Nov. 15, 2013

Nov. 20, 2013

Mar/Apr 2014

Ceramics, Thick & Thin Materials

Jan. 15, 2014

Jan. 20, 2014

May/Jun 2014

3D including 3DIC and 3D Packaging (PoP)

Mar. 15, 2014

Mar. 20, 2014

Jul/Aug 2014

IMAPS 2014 (San Diego) Show Issue

May 15, 2014

May 20, 2014

Sep/Oct 2014

MEMS and Thermal Management

July 15, 2014

July 20, 2014

Nov/Dec 2014

Assembly, OSATs, SMT

Sept. 15, 2014

Sept. 20, 2014

Advertising Opportunities / Media Kit

Contact Ann Bell, Manager, Advertising/Sales
at abell@imaps.org

 

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