KESTER

Advancing Microelectronics Editorial Schedule

Issue Theme Copy Deadline Ad Commitment I/Os Deadline

Jan/Feb 2017

Device Packaging Conference, Wafer Level Packaging, Integrated Passives

Nov. 15, 2016

Nov. 20, 2016

Mar/Apr 2017

Ceramics, Thick & Thin Materials

Jan. 15, 2017

Jan. 20, 2017

May/Jun 2017

3D including 3DIC and 3D Packaging (PoP)

Mar. 15, 2017

Mar. 20, 2017

Jul/Aug 2017

IMAPS 2017 (Raleigh) Show Issue

May 15, 2017

May 20, 2017

Sep/Oct 2017

MEMS and Thermal Management

July 15, 2017

July 20, 2017

Nov/Dec 2017

Assembly, OSATs, SMT

Sept. 15, 2017

Sept. 20, 2017

Advertising Opportunities / Media Kit

Contact Ann Bell, Manager, Advertising/Sales
at abell@imaps.org

 

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