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IMAPS and SEMI proudly announce a
Topical Workshop on

Advanced Interconnect Technologies
Wednesday, July 13, 2011
San Francisco Marriott Hotel
San Francisco, California - USA

Be sure to attend other IMAPS co-located events:
IMAPS Workshop on Wire Bonding; and

IMAPS TechXPOT on Next Generation Materials and Processing for High Performance Packaging (July 13).
And don't miss othe activities at SEMICON West 2011

Early Registration Deadline: June 24, 2011
Hotel Deadline: June 29, 2011

Chair:

Co-Chair:

Anwar Mohammed
Huawei Technologies amohammed@huawei.com

Chuck Woychick
Tessera
cwoychik@tessera.com



Workshop Focus:
The Advanced Interconnect Technologies Workshop has been organized to allow for the presentation and debate of some of the latest interconnect and processing technologies in Electronic Packaging that support ever increasing device pitch and the need to embed increased levels of both passive and active functionality.

Session Synopsis:
There is a relentless pressure on Advanced Interconnect designs. We are all too familiar about the insatiable quest for enhanced functionality and more sophisticated performance with increasing power requirements in diminishing packaging profiles. While that might contain allusions for job security the challenge is nevertheless very daunting and vexing. The session’s dwells around some emerging technologies that strive to answer some of our most burning questions. New package stacking and 2.5D technology is covered while keeping an eye on some innovative cost reduction approaches like a super fast cure underfill, low temperature copper pillar bonding and a low cost FR4 material solution with 110 GHz transmission line properties. Wirebonding reliability is also covered in two different presentations. The session is designed to address some of the immediate challenges facing all of us.

Wednesday, July 13, 2011

Registration: 12:30 pm - 5:00 pm

Opening Remarks: 12:55 pm - 1:00 pm
Chairs: Anwar Mohammed, Huawei Technologies & Chuck Woychick, Tessera

Session 1
1:00 pm - 2:30 pm

Silicon Interposers Enable 2.5D Assembly
Phil Marcoux, ALLVIA

Which US Frequency is Best for Wirebonding?
Josef Sedlmair, Uwe Nacke, Franz Schlicht, Farhad Farassat, F&K Delvotec Bondtechnik GmbH

High Current Testing of Gold and Copper Wirebonds
L. Nguyen, National Semiconductor Corp.

Break: 2:30 pm - 3:00 pm

Session 2
3:00 pm - 5:00 pm

Reliability of 125um Flip Chip Interconnects for Wireless Applications
Rajesh Katkar, M. Huyhn, R. Zhang, E. Chau, L. Mirkarimi, P. Damberg, Invensas Corporation 

A Low Cost Manufacturing Solution - Low Temperature Super-Fast Cure and Flow Reworkable Underfill
Wusheng Yin, Mary Liu, YINCAE Advanced Materials, LLC

Characteristics of Interconnects on FR408 at Millimeter-Wave Frequencies
Supreetha Aroor, Manish Nair, Rashaunda Henderson, The University of Texas at Dallas

Next Generation PoP Technology
Hamid Eslampour, InSang Yoon, YoungChul Kim, SungEun Park, KeonTaek Kang, STATSChipPac

Closing Remarks: 5:00 pm

Take some time to visit SEMICON West2011
www.semiconwest.org




Housing:Hotel Cut-off is June 29, 2011

The IMAPS Topical Workshop is being run at the San Francisco Marriott Hotel, in conjunction with SEMICON West.

San Francisco Marriott Hotel
55 Fourth Street
San Francisco, CA 94103

 

Speaker Dates/Information:

  • Abstract(s) due to IMAPS: April 30, 2011
  • Speaker Notification/Confirmation emailed: May 10, 2011
  • Extended Abstract or Presentation Material due: June 18, 2011
  • Early Registration Deadline: June 29, 2011
  • Hotel Deadline: June 29, 2011
  • Powerpoint/Presentation file for CD-Rom due not later than: July 13, 2011
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

 


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