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IMAPS and SEMI proudly announce a
Topical Workshop on |
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Adhesives/Encapsulants/Molding
Monday, July 13, 2009
Moscone Center, San Francisco, CA
This event will run parallel to the Wire Bonding workshop
with one admission fee prior to SEMICON West 2009 – July 14-16.
Abstract Deadline: February 20, 2009
Adhesives/Encapsulants/Molding Workshop Focus:
The objective of the Adhesives, Encapsulation and Molding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people who have been working in this area of technology. This workshop has been specifically organized to allow for the presentation on the latest current thinking on these focus areas of technologies.
- Glob Top Encapsulants
- Thermo-Compression Molded Packages
- Corner and Edge Bond of CSP Devices
- CSP Underfill
- Flip Chip Underfill
- Flip Chip Underfill and Molding
- Surface Preparation to Improve Adhesion and Flow Characteristics
- • Simulation and Modeling
- Failure Analysis and Reliability
- UV Adhesives
- Alternative Interconnect for Flip Chip
Those wishing to present a paper at the Adhesives, Encapsulants and Molding Topical Workshop must submit a 200-300 word abstract electronically by February 20, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than June 12, 2009.
Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.
Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.
All Speakers are required to pay a reduced registration fee and are required to attend the entire event.
Submit Abstract(s)
Housing: Hotel Details Available Soon
Speaker Dates/Information:
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Abstract(s) due to IMAPS: February 20, 2009
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Speaker Notification/Confirmation emailed: February 20, 2009
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Extended Abstract or Presentation Material due: June 12, 2009
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Powerpoint/Presentation file for CD-Rom due not later than: July 13, 2009
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Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
- Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)
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