Micross

Advanced Technology Workshop and Tabletop Exhibition on
Advances in Semiconductor Packaging

June 15, 2017
Binghamton University | Center of Excellence Building
85 Murray Hill Road
Vestal, New York 13850 - USA



Early Registration Deadline: May 26, 2017

Registration Details | Register Online | Sponsorship
Speaker Information


General Chair:
Andy Mackie, Indium Corporationt

Committee:
Benson Chan, Binghamton University | Jeff Knight, Universal Instruments | Voya Markovich, Consultant | Jim Wilcox, Universal Instruments

The world of semiconductor packaging is becoming increasingly diverse and more complex. Mobile devices and wearables are the near-term visible part of the IoT with wireless networking, servers, switches and networks the invisible backbone. This ATW will bring together experts from around the world to discuss challenges in assembly processes, materials, reliability and packaging technologies, and the technology advances and material developments that are being made to overcome them.


 

THURSDAY, JUNE 15


7:00am-6:00pm Registration Open

9:30am-4:30pm

EXHIBITS OPEN (when not in session)
Meet with these great sponsors and exhibitors!

DS&A, LLC
Geib Refining Corporation
KemLab
Lyons & Associates
Midas Technology
Pfeiffer Vacuum
Process Solutions Consulting
Quik-Pak, a division of Promex Industries
XL VAC TECH


7:30am-8:00am Coffee

8:00am-8:15am Welcome (IMAPS) and Overview (Binghamton University)
Andy Mackie, Indium Corp., General Chair

8:15am-9:00am

KEYNOTE PRESENTATION:
Flexible Hybrid Electronics – A New Era for Packaging

Methods to integrate electronic devices and manufacture on rigid silicon wafers are well established. Device dimensions have continued to shrink and performance continues to increase each year. Electronic device fabrication using flexible non-silicon-wafer surfaces has started to emerge. Engineered polymer films such as PET, PI, PEN, papers, as well as thin flexible metal foils and glass are viable substrates for this technology. Key substrate properties include: dimensional and thermal stability, low moisture uptake, ultra low gas and moisture transmission rates and nano-scale surface roughness. Electronic function on flexible substrates may enable dramatically new approaches to traditional applications including: information displays, lighting, solar energy conversion and diagnostic medicine. This talk will examine how some of the basic semiconductor manufacturing processes can be adapted for use with flexible substrate materials and suggest a means for manufacturing ubiquitous flexible hybrid electronics in the future. Advancements in manufacturing processes such as roll-to-roll handling, slot-die coating, ink-jet printing, vacuum deposition, photolithography and wet processing will be described. Examples will include fabrication of electronic devices and antennas on thin flexible glass and the use thin silicon die on flexible plastic substrates for biomedical applications.

 

Mark D. Poliks Mark D. Poliks is a Professor of Systems Science and Industrial Engineering and Director of the Center for Advanced Microelectronics Manufacturing (CAMM) at the State University of New York at Binghamton. He holds joint faculty appointment in the Materials Science and Engineering Program at Binghamton. His research is in the areas of high performance electronics packaging, flexible electronics, materials, processing, roll-to-roll manufacturing, in-line quality control and reliability. He is the lead on the New York State Node of the NextFlex Manufacturing USA Institute and was recently named a NextFlex Fellow. He has authored numerous technical papers and invited presentations. He holds over forty-five US patents.

SESSION 1

HIGH PERFORMANCE COMPUTING
Session Chair: Jim Wilcox, Universal Instruments

9:00am-9:30am Reliability Analysis of a Wearable Sensor Patch (WSP) to Monitor ECG Signals
Varun Soman, Binghamton University (Mark Poliks, James Turner, Mark Schadt, Michael Shay, Frank Egitto)
9:30am-10:00am Meeting High Performance Computing Signal and Power Integrity Requirements with Novel Technologies
How Lin, ExSys Technology, Inc.

10:00am-10:30am

Coffee Break in the Exhibit Area


10:30am-11:00am The Impact of new Generation Chemical Treatment Systems on High Frequency Signal Integrity
James Fuller, Sanmina Corporation 
11:00am-11:30am Panel Level Semiconductor Packaging Assembly Challenges
Glenn Farris, Universal Instruments (Mike Yingling) 
11:30am-12:00pm Vertical Interconnection with Electrically Conductive Adhesives: Enhanced Wiring Density, Improved Yields, and Layer Reduction in High Layer Count Substrates and Printed Wiring Boards
Frank Egitto, i3 Electronics (Mark Schadt, John Lauffer, Kostas Papathomas, Kevin Knadle, Brett Pennington, Michael Shay, Gordon Benninger) 

12:00pm-1:00pm Lunch in the Exhibit Area
(w/ Student POSTER COMPETITION -- $1000 Foundation Awards)

1:00pm-2:00pm Optional Tour of Binghamton University Labs
ADL, IEEC, NECCES, Data Center
Tour of some of the Research Centers under the S3IP, Binghamton University

2:00pm-2:45pm

KEYNOTE PRESENTATION:
Design and Manufacturing of Flexible Hybrid Electronic Devices

Advanced flexible hybrid electronic (FHE) substrates coupled with ultra fine flip chip assembly meets the challenges of miniaturization and unique form factor requirements. Ultra-thin flexible base polymer films, e.g., on the order of 12.5 µm thick, have been fabricated for assemblies that can be rolled or folded into very small form factors. Examples are given of highly miniaturized assemblies for use in a single-sided flexible module for an intravascular ultrasound catheter, a double-sided flexible device used as an in-vivo diagnostic device, and a double-sided flexible skin-wearable device capable of detecting and wirelessly transmitting a wearer’s ElectroCardioGram (ECG) and body temperature applications. The use of semi-additive plating (SAP) process enables fine-line circuit features. The SAP, or pattern plating, process provides the solder surface mount and interconnection pathways of both passive and active electronic devices on the substrate. For double-sided flexible modules, electrical interconnection between the two sides of a base polymer flexible film is achieved using laser drilled and copper-plated through holes (PTHs). During substrate fabrication and component assembly processes, the film is held flat and taut by affixing it to a stainless steel frame. This is especially important for applications requiring ultra thin polymer materials. Substrate fabrication often includes application of a flexible solder mask. Examples of physical design ground rules for enhancing performance through flex fatigue testing are discussed. The resultant FHE devices are robust under rolling, folding, and flexing.

Charles Woychik Charles Woychik is the Chief Scientist of R&D at i3 Electronics in Endicott, NY. Previously he was the Senior Director of 3D Technology for Invensas Corporation. Prior to Invensas, Chuck worked 5 years for General Electric Global Research, after spending the first 18 years of his career with IBM. His area of expertise is materials and processes for electronics packaging. He holds a doctorate and Masters of Science degree in Materials Science and Engineering from Carnegie-Mellon University. He has a Bachelor’s of Science degree in Materials Science from the University of Wisconsin, Madison. Chuck has numerous publications and 86 issued US patents to his credit.

SESSION 2

ELECTRONICS PACKAGING, MATERIALS, AND FABRICATION
Session Chair: Voya Markovich, Consultant

2:45pm-3:15pm Semiconductor Assembly and Materials Reliability for Evolving Automotive Electronics Applications
Andy Mackie, Indium Corporation (Ning-Cheng Lee)
3:15pm-3:45pm Vapor Phase Polymerized PEDOT Thin Film on EDOT Seeded Substrate & Microcontact Printed PEDOT
Boxiao Li, Binghamton University (Marissa Civic, Ziqi Qing, Linyue Tong, Steve Boyer, William Bernier, Wayne Jones, Jr)  

3:45pm-4:30pm

Coffee Break in the Exhibit Area


4:30pm-5:00pm Fabrication and Characterization of Femtosecond Laser-written Waveguides in Flexible Glass 
Rostislav Grynko, Binghamton University (Garima Nagar, Dennis Dempsey, James Sutherland, Bonggu Shim)
5:00pm-5:30pm Glass with Embedded Waveguides for Photonic Packaging
Lars Brusberg, Corning Research & Development Corporation

5:30pm Closing Remarks

   

 


Speaker Dates/Information:

  • Abstract Deadline: March 31, 2017
  • Speaker Email Notification: May 4, 2017
  • Early Registration Deadline: May 26, 2017
  • Speaker 2-3 sentence biography due not later than: June 1, 2017
  • Powerpoint/Presentation file for DOWNLOAD due not later than: June 15, 2017
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop/usb or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)
  • Keynote Presentation Time: 45 minutes (40 to present; 5 for Q&A)

    Presentation Format/Template:
    IMAPS does not require you to use a conference powerpoint template.
    You are able to use your regular company/preferred powerpoint templates.
    Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

    Dress Code:
    There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

    Session rooms will be equipped with:
    Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

    All session presentations are 25 minutes followed by 5 minutes for Questions
    You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
    Speak with your session chair if you need assistance.

    About the Session:
    Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

    Photography is not permitted in the session rooms.

    Silence all mobile phones during session attendance.

 


Registration Information: (Early Registration Deadline: May 26, 2017)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentations as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 5/26/17
Advance/Onsite Fee
After 5/26/17
IMAPS Member
$425
$475
Non-Member
$525
$575
Speaker
$250
$300
Session Chair
$250
$300
Student
$25
$50
Chapter Officer
$250
$300
Tabletop Exhibit
(includes: 1 six-foot table and chairs, 1 booth personnel registration with meals included, attendee lists, recognition in program and on website)
$400
$500
Premier Event Sponsorship
(includes: 1 tabletop exhibit, 1 attendee registration, print advertisement in programs, flyer/giveaway distributed to all attendees, logo/advertisement on event webpages)
$800
$800

Register On-line


 

CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems