Advanced Technology Workshop and Tabletop Exhibition on
Advances in Semiconductor Packaging

June 15, 2017
Binghamton University | Center of Excellence Building
85 Murray Hill Road
Vestal, New York 13850 - USA

Abstracts Due: March 31, 2017
Early Registration Deadline: May 26, 2017

Submit Abstracts
Registration Details | Register Online (soon) | Sponsorship
Student Competition | Speaker Information

General Chair:
Andy Mackie, Indium Corporationt

Benson Chan, Binghamton University | Jeff Knight, Universal Instruments | Voya Markovich, Consultant | Jim Wilcox, Universal Instruments

The world of semiconductor packaging is becoming increasingly diverse and more complex. Mobile devices and wearables are the near-term visible part of the IoT with wireless networking, servers, switches and networks the invisible backbone. This ATW will bring together experts from around the world to discuss challenges in assembly processes, materials, reliability and packaging technologies, and the technology advances and material developments that are being made to overcome them.

Planned Sessions Include:

    • Processes:
      • Waferbumping
      • Wirebonding
      • Die-bonding
      • Flip-Chip
      • Thermocompression bonding
      • Ball-attach
    • Materials:
      • Solders
      • Die-attach adhesives
      • Polymer films
      • Molding compounds and underfills
      • Thermal interface materials
      • Substrates - Glass, Wafer
    • Package Types:
      • System in Package (SiP)
      • Embedded Die
      • Power Discretes & Modules
      • Waferlevel CSP
      • MEMS devices
      • Photonics Packaging
    • Power Devices:
      • Discretes
      • IGBT Modules
      • Multichip modules
      • Testing Photonics Packaging

Those wishing to make a presentation at the Workshop, please submit a 500 word abstract electronically by March 31, 2017, using the on-line submittal form at: If you need assistance with the on-line submission form, please email Brian Schieman (

A post-conference DOWNLOAD containing the full presentation material as supplied by authors will be distributed to all attendees. All speakers are required to pay a reduced registration fee.

Speaker Dates/Information:

  • Abstract Deadline: March 31, 2017
  • Speaker Email Notification: April 21, 2017
  • Early Registration Deadline: May 26, 2017
  • Speaker 2-3 sentence biography due not later than: June 1, 2017
  • Powerpoint/Presentation file for DOWNLOAD due not later than: June 15, 2017
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop/usb or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)
  • Keynote Presentation Time: 45 minutes (40 to present; 5 for Q&A)

    Presentation Format/Template:
    IMAPS does not require you to use a conference powerpoint template.
    You are able to use your regular company/preferred powerpoint templates.
    Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

    Dress Code:
    There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

    Session rooms will be equipped with:
    Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

    All session presentations are 25 minutes followed by 5 minutes for Questions
    You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
    Speak with your session chair if you need assistance.

    About the Session:
    Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

    Photography is not permitted in the session rooms.

    Silence all mobile phones during session attendance.


Student Paper/Poster Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check at the ATW/Conference. The selected student must attend the event to present his or her work and receive the award.

The Microelectronics Foundation


Registration Information: (Early Registration Deadline: May 26, 2017)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentations as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Early Fee
Through 5/26/17
Advance/Onsite Fee
After 5/26/17
IMAPS Member
Session Chair
Chapter Officer
Tabletop Exhibit
(includes: 1 six-foot table and chairs, 1 booth personnel registration with meals included, attendee lists, recognition in program and on website)
Premier Event Sponsorship
(includes: 1 tabletop exhibit, 1 attendee registration, print advertisement in programs, flyer/giveaway distributed to all attendees, logo/advertisement on event webpages)

Register On-line (AVAILABLE SOON)


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