Technology Workshop and Tabletop Exhibition on
Advances in Semiconductor Packaging
June 15, 2017
Binghamton University | Center of Excellence Building
85 Murray Hill Road
Vestal, New York 13850 - USA
Early Registration Deadline: May 26, 2017
The world of semiconductor packaging is becoming increasingly diverse and more complex. Mobile devices and wearables are the near-term visible part of the IoT with wireless networking, servers, switches and networks the invisible backbone. This ATW will bring together experts from around the world to discuss challenges in assembly processes, materials, reliability and packaging technologies, and the technology advances and material developments that are being made to overcome them.
THURSDAY, JUNE 15
EXHIBITS OPEN (when not in session)
|8:00am-8:15am||Welcome (IMAPS) and Overview (Binghamton University)
Andy Mackie, Indium Corp., General Chair
HIGH PERFORMANCE COMPUTING
|9:00am-9:30am|| Reliability Analysis of a Wearable Sensor Patch (WSP) to Monitor ECG Signals
Varun Soman, Binghamton University (Mark Poliks, James Turner, Mark Schadt, Michael Shay, Frank Egitto)
|9:30am-10:00am||Meeting High Performance Computing Signal and Power Integrity Requirements with Novel Technologies
How Lin, ExSys Technology, Inc.
Coffee Break in the Exhibit Area
|10:30am-11:00am|| The Impact of new Generation Chemical Treatment Systems on High Frequency Signal Integrity
James Fuller, Sanmina Corporation
|11:00am-11:30am||Panel Level Semiconductor Packaging Assembly Challenges
Glenn Farris, Universal Instruments (Mike Yingling)
|11:30am-12:00pm||Vertical Interconnection with Electrically Conductive Adhesives: Enhanced Wiring Density, Improved Yields, and Layer Reduction in High Layer Count Substrates and Printed Wiring Boards
Frank Egitto, i3 Electronics (Mark Schadt, John Lauffer, Kostas Papathomas, Kevin Knadle, Brett Pennington, Michael Shay, Gordon Benninger)
|12:00pm-1:00pm||Lunch in the Exhibit Area
(w/ Student POSTER COMPETITION -- $1000 Foundation Awards)
|1:00pm-2:00pm||Optional Tour of Binghamton University Labs
ADL, IEEC, NECCES, Data Center
Tour of some of the Research Centers under the S3IP, Binghamton University
ELECTRONICS PACKAGING, MATERIALS, AND FABRICATION
|2:45pm-3:15pm||Semiconductor Assembly and Materials Reliability for Evolving Automotive Electronics Applications
Andy Mackie, Indium Corporation (Ning-Cheng Lee)
|3:15pm-3:45pm||Vapor Phase Polymerized PEDOT Thin Film on EDOT Seeded Substrate & Microcontact Printed PEDOT
Boxiao Li, Binghamton University (Marissa Civic, Ziqi Qing, Linyue Tong, Steve Boyer, William Bernier, Wayne Jones, Jr)
Coffee Break in the Exhibit Area
|4:30pm-5:00pm||Fabrication and Characterization of Femtosecond Laser-written Waveguides in Flexible Glass
Rostislav Grynko, Binghamton University (Garima Nagar, Dennis Dempsey, James Sutherland, Bonggu Shim)
|5:00pm-5:30pm||Glass with Embedded Waveguides for Photonic Packaging
Lars Brusberg, Corning Research & Development Corporation
- Abstract Deadline: March 31, 2017
- Speaker Email Notification: May 4, 2017
- Early Registration Deadline: May 26, 2017
- Speaker 2-3 sentence biography due not later than: June 1, 2017
- Powerpoint/Presentation file for DOWNLOAD due not later than: June 15, 2017
- Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop/usb or email to firstname.lastname@example.org prior to event)
- Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)
Presentation Time: 45 minutes (40 to present; 5 for Q&A)
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.
Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.
All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.
About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).
Photography is not permitted in the session rooms.
Silence all mobile phones during session attendance.
Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentations as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.