| Member |
Company/Affiliation |
| Dr. Selim Achmatowicz |
Institute of Electronic Materials Technology |
| Mr. Robert V. Allen |
|
| Mr. Daniel I. Amey |
|
| Mr. Len Anderson |
MPC |
| Dr. Ronald P. Anjard |
Anjard International Consultants/AIC |
| Mr. Russell Atkinson |
Avid Associates, Inc. |
| Dr. Peter G. Barnwell |
Barry Industries |
| Mr. J. Howard Beck |
|
| Mr. Paul H. Beddo |
|
| Mr. Christian Belady |
Microsoft Corporation |
| Mr. Dennis F. Bernier |
Kester |
| Mr. Robert W. Bibby |
Delphi Corporation |
| Mr. Delip "Doug" R. Bokil |
Namark Process Design LLC |
| Mr. J. P. Bradley |
|
| Mr. Richard M. Breck |
|
| Mr. Charles Brown |
Vicor |
| Mr. Don Brown |
IWPC |
| Mr. Dennis L. Bryant |
Micro Printing Systems |
| Dr. Leonard S. Buchoff |
Thomas and Betts |
| Dr. Robert W. Burns |
Data I/D |
| Mr. James Byrom |
Accu-Tech Laser Processing, Inc. |
| Mr. Roger L. Cadenhead |
|
| Mr. Dwight W. Callaway |
|
| Mr. Greg Caswell |
D2M Technologies |
| Dr. Rajen Chanchani |
Sandia National Laboratories |
| Mr. Leslie W. Chapin |
Beckman Industrial Corp. |
| Dr. Harry K. Charles |
Johns Hopkins University |
| Mr. Michal Ciez |
Institute of Electron Technology |
| Mr. Richard J. Clark |
|
| Mr. Paul E. Collander |
Poltronic Ltd |
| Mr. Rene E. Cote |
Unicorn Designs |
| Mr. Phillip G. Creter |
Creter and Associates |
| Mr. Hugh J. Curnan |
|
| Dr. Hans O. Danielsson |
MikroElektronik Konsult AB |
| Dr. Sei-Ichi Denda |
Nagano Institute of Technology |
| Mr. Arthur W. Dobie |
SEFAR Printing Solutions, Inc. |
| Mr. George A. Doyle |
IMAPS FOUNDER |
| Mr. Jim R. Drehle |
Robert Lloyd & Associates |
| Dr. Aicha Elshabini |
University of Idaho |
| Mr. Werner Engelmaier |
Engelmaier Associates, Inc. |
| Mr. Samuel F. Forman |
TT-Apsco |
| Dr. Shen-Li Fu |
I-Shou University |
| Dr. Yoshitaka Fukuoka |
Weisti |
| Dr. Philip E. Garrou |
Microelectronic Consultants of NC |
| Mr. Richard W. Gehman |
|
| Mr. Robert D. Gold |
|
| Mr. Gerald Goldstein |
|
| Dr. Leszek J. Golonka |
Wroclaw University of Technology |
| Mr. Dimitry G. Grabbe |
AMP, Inc. |
| Mr. John Graves |
EDO EVI, Inc. |
| Mr. Tom Green |
TJ Green Associates LLC |
| Mr. Bernie Greenstein |
|
| Mr. Werner F. Grundmann |
|
| Mr. Morton L. Hagenbuechle |
|
| Mr. Donald W. Hamer |
State of the Art, Inc. |
| Mr. Bill M. Hargis |
Consultant |
| Mr. George G. Harman |
NIST |
| Mr. Charles A. Harper |
|
| Dr. Gabor Harsanyi |
Budapest University of Technology and Economics |
| Dr. Kaoru Hashimoto |
Japan Institute of Electronics Packaging |
| Mr. Kermit W. Heid |
|
| Mr. Richard P. Himmel |
TekSource |
| Mr. John F. Hinchey |
|
| Mr. Alan M. Hirschberg |
Northrop Grumman Space Technologies |
| Mr. Robert Holmes |
Hints Unlimited |
| Dr. Douglas C. Hopkins |
University of Buffalo |
| Mr. E. Bruce Hultmark |
|
| Mr. Gary W. Johnson |
Wabash Technologies |
| Dr. R. Wayne Johnson |
Auburn University |
| Dr. W. Kinzy Jones |
Florida International University |
| Mr. William Kahn |
Martin Marietta |
| Dr. James R. Keski |
Keski International |
| Dr. Roupen L. Keusseyan |
DuPont Electronics |
| Mr. Dennis C. Keyfauver |
Raytheon Company |
| Dr. Wulf H. Knausenberger |
IDC |
| Mr. Jon F. Krause |
|
| Dr. Tadashi Kubota |
Japan Technological R&D Labs |
| Dr. Karel Kurzweil |
|
| Mr. Richard C. Landis |
|
| Mr. George D. Lane |
Coining, Inc. |
| Mr. Jim C. Lawson |
Advanced Packaging Association |
| Ira Leonard |
Timeplex-LLC |
| Mr. Martin P. Lepselter |
BTL Fellows |
| Mr. Lee R. Levine |
Process Solutions Consulting |
| Dr. James J. Licari |
AvanTeco Corp. |
| Prof. Benedykt Licznerski |
Institute of Microsystem Technology |
| Mr. Andy London |
Heraeus Thick Film Division |
| Mr. David J. Malanga |
Heraeus Thick Film Division |
| Mr. F. Wayne Martin |
FWM Network |
| Ms. Mary McDonald |
The McDonald Consulting Group |
| Mr. Carl Missele |
|
| Norio Miura |
|
| Mr. Fumio Miyashiro |
PI R&D Co, Ltd. |
| Dr. Arthur H. Mones |
|
| Dr. Fred Morritz |
|
| Ms. Susan M. Munyon |
Saint-Gobain Ceramics |
| Dr. Yoshikazu Nakamura |
Future Package Technology |
| Dr. Herbert Neuhaus |
|
| David Nixen |
|
| Mr. Soeren Noerlyng |
Micronsult |
| Prof. Stanislaw Nowak |
Univeristy of Mining & Metallurgy |
| Dr. Michael Pecht |
University of Maryland |
| Mr. Ray P. Petit |
Pacific Rim International, Inc. |
| Mr. Vernon B. Powers |
Interim Solutions |
| Mr. Jon Prokop |
RF Monolithics |
| Mr. Jason D. Provance |
Thick Film Consultants |
| Mr. Steve Reiss |
Semiconductor International |
| Mr. Lawrence J. Rexing |
Heraeus Thick Film Division |
| Dr. Dietrich E. Riemer |
Boeing Research and Technology |
| Dr. Bruce M. Romenesko |
Johns Hopkins University/APL |
| Mr. Loren E. Saar |
|
| Dr. Leonard W. Schaper |
University of Arkansas |
| Mr. Joseph A. Scordato |
|
| Mr. Charles Q. Scrantom |
Scrantom Engineering, Inc. |
| Dr. Jerry E. Sergent |
Fairfield University |
| Mr. Yuzo Shimada |
NEC Corporation |
| Prof. Nihal Sinnadurai |
ATTAC |
| Mr. Harvey W. Smith |
EMA Sales & Marketing |
| Mr. David T. Somerville |
RF Monolithics, Inc. |
| Mr. Jack Staller |
Graphics Automation |
| Dr. Sidney J. Stein |
ElectroScience |
| Mr. Donald C. Sutherland |
|
| Dr. Ivan Szendiuch |
Brno University of Technology |
| Mr. Iwao Tachikawa |
Musashi Engineering, Inc. |
| Mrs. Janette R. Thomas |
|
| Mr. John R. Thome |
John R. Thome & Associates |
| Mr. Allen B. Timberlake |
Northrop Grumman |
| Dr. Rao R. Tummala |
Georgia Tech - Microsystems Packaging Research Center |
| Mr Christian M. VAL |
3D PLUS |
| Mr. Ernie Vasvary |
Micro Systems Engineering |
| Mr. Robert L. Waer |
|
| Dr. Shinichi Wakabayashi |
Korea Shinko Microelectronics |
| Mr. Sigurd R. Wathne |
Sikama International, Inc. |
| Mr. Alvin H. Weinberg |
St. Jude Medical CRMD |
| Mr. James D. Welterlen |
Welterlen, Inc. |
| Mr. Manford H. Williamson |
Boeing - Retired |
| Mr. Donald C. Wood |
KL Marketing |
